IC-GD datasheet(3/55 Pages) ICHAUS

3 / 55 page

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iC-GD

UNIVERSAL I/O INTERFACE

Rev A1, Page 3/55

PACKAGING INFORMATION QFN38 5 mm x 7 mm to JEDEC Standard

PIN CONFIGURATION QFN38 5 mm x 7 mm

13 14 15 16 17 18 19

PIN FUNCTIONS

No. Name Function

1 ADR0 Address 0 input

2 ADR1 Address 1 input

3 ADR2 Address 2 input

4 VCC

Supply voltage 3.3...5 V

5 GNDL Logic Ground

6 TEST Test pin

PIN FUNCTIONS

No. Name

Function

7 VPD

5 V voltage output

8 VRPH

Modulator mid voltage

9 VREF

Modulator reference voltage

10 LED1

LED1 driver output

11 VNB

Supply voltage -15 V

12 UN1

Voltage negative channel 1

13 UI1

Voltage current channel 1

14 UP1

Voltage positive channel 1

15 IA1

Current output analog/digital channel 1

16 GNDP Power Ground

17 VDA

Supply voltage 24 V

18 IA2

Current output analog/digital channel 2

19 UP2

Voltage positive channel 2

20 UI2

Voltage current channel 2

21 UN2

Voltage negative channel 1

22 VB

Supply voltage +15 V

23 LED2

LED2 driver output

24 VPA

5 V voltage output

25 RP

Resistor pin 1

26 RN

Resistor pin 2

27 GNDA Analog Ground

28 NRES

Reset input (low active)

29 RDY

Ready output

30 NCS

Chip select input (low active)

31 SCLK

SPI clock input

32 SDI

SPI data input

33 SDO

SPI data output

34 SYNC1 Synchronization channel 1

35 SYNC2 Synchronization channel 2

36 IRQ

Interrupt output

37 SCL

Serial clock input

38 SDA

Serial data input

The Thermal Pad is to be connected to a Ground Plane (GNDP) on the PCB.

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