From Transmitter

From Receiver

W

Write

A

Acknowledge

S

Start Condition

P

Stop Condition

Data

S

Slave Address

Sub Address

A

W

P

A

A

Data

A

Data

A

S

Slave Address

Sub Address

A

W

Sr

A

P

From Transmitter

From Receiver

Sr Restart Condition

A

Acknowledge

S

Start Condition

P

Stop Condition

A

R

A

Slave Address

Data

A

Not Acknowledge (SDA High)

W

Write

R

Read

Data

S

Slave Address

R

P

From Transmitter

From Receiver

R

Read

A

Acknowledge

S

Start Condition

P

Stop Condition

A

A

Not Acknowledge (SDA High)

A

Data

A

TFP501

www.ti.com

SLDS127C

– JULY 2001 – REVISED JULY 2011

Figure 20. HDCP Port Link Integrity Message Read

PowerPAD

™ 100-Pin TQFP PACKAGE

The TFP501 is packaged in TI's thermally enhanced PowerPAD 100-pin TQFP packaging. The PowerPAD

package is a 14 mm y 14 mm y 1 mm TQFP outline with 0.5mm lead-pitch. The PowerPAD package has a

specially designed die mount pad that offers improved thermal capability over typical TQFP packages of the

same outline. The TI 100-pin TQFP PowerPAD package offers a backside solder plane that connects directly to

the die mount pad for enhanced thermal conduction. Soldering the backside of the TFP501 to the application

board is not required thermally, as the device power dissipation is well within the package capability when not

soldered.

Soldering the backside of the device to the PCB ground plane is recommended for electrical considerations.

Since the die pad is electrically connected to the chip substrate and hence chip ground, connection of the

PowerPAD back side to a PCB ground plane helps to improve EMI, ground bounce, and power supply noise

performance.

Table 1 outlines the thermal properties of the TI 100-pin TQFP PowerPAD package. The 100-pin TQFP

non-PowerPAD package is included only for reference.

Copyright

© 2001–2011, Texas Instruments Incorporated

19