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BCM4354 датащи(PDF) 12 Page - Cypress Semiconductor |
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BCM4354 датащи(HTML) 12 Page - Cypress Semiconductor |
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12 / 192 page ![]() Table of Contents BCM4354 Data Sheet Broadcom® October 15, 2014 • 4354-DS109-R Page 11 BROADCOM CONFIDENTIAL Section 18: Internal Regulator Electrical Specifications ............................................. 158 Core Buck Switching Regulator.............................................................................................................. 158 3.3V LDO (LDO3P3) .................................................................................................................................. 159 3.3V LDO (LDO3P3_B).............................................................................................................................. 160 2.5V LDO (BTLDO2P5) ............................................................................................................................. 161 CLDO ......................................................................................................................................................... 162 LNLDO ....................................................................................................................................................... 163 Section 19: System Power Consumption...................................................................... 164 WLAN Current Consumption................................................................................................................... 164 Bluetooth and FM Current Consumption ............................................................................................... 166 Section 20: Interface Timing and AC Characteristics .................................................. 167 SDIO Timing.............................................................................................................................................. 167 SDIO Default Mode Timing ................................................................................................................. 167 SDIO High-Speed Mode Timing.......................................................................................................... 169 SDIO Bus Timing Specifications in SDR Modes ................................................................................. 170 Clock Timing ................................................................................................................................ 170 Device Input Timing ..................................................................................................................... 171 Device Output Timing................................................................................................................... 172 SDIO Bus Timing Specifications in DDR50 Mode............................................................................... 174 Data Timing, DDR50 Mode .......................................................................................................... 175 HSIC Interface Specifications.................................................................................................................. 176 PCI Express Interface Parameters .......................................................................................................... 177 JTAG Timing ............................................................................................................................................. 179 Section 21: Power-Up Sequence and Timing ............................................................... 180 Sequencing of Reset and Regulator Control Signals ........................................................................... 180 Description of Control Signals ............................................................................................................. 180 Control Signal Timing Diagrams.......................................................................................................... 181 Section 22: Package Information ................................................................................... 184 Package Thermal Characteristics ........................................................................................................... 184 Junction Temperature Estimation and PSIJT Versus ThetaJC.............................................................. 185 Environmental Characteristics................................................................................................................ 185 Section 23: Mechanical Information .............................................................................. 186 Section 24: Ordering Information .................................................................................. 190 |
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