RF430CL331HIPWR datasheet(9/60 Pages) TI1

9 / 60 page

RF430CL331H

www.ti.com

SLASE18A – SEPTEMBER 2015 – REVISED NOVEMBER 2015

4.8

Thermal Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER

VALUE

UNIT

θJA

Junction-to-ambient thermal resistance, still air(1)

116.0

°C/W

θJC(TOP)

Junction-to-case (top) thermal resistance(2)

45.1

°C/W

θJB

Junction-to-board thermal resistance(3)

TSSOP-14 (PW)

57.6

°C/W

ΨJB

Junction-to-board thermal characterization parameter

57.0

°C/W

ΨJT

Junction-to-top thermal characterization parameter

4.6

°C/W

θJA

Junction-to-ambient thermal resistance, still air(1)

48.8

°C/W

θJC(TOP)

Junction-to-case (top) thermal resistance(2)

60.8

°C/W

θJC(BOT)

Junction-to-case (bottom) thermal resistance(4)

7.1

°C/W

VQFN-16 (RGT)

θJB

Junction-to-board thermal resistance(3)

21.9

°C/W

ΨJB

Junction-to-board thermal characterization parameter

21.9

°C/W

ΨJT

Junction-to-top thermal characterization parameter

1.5

°C/W

(1)

The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(2)

The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC

standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(3)

The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

(4)

The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific

JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

Specifications

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