MPC7457 datasheet(60/71 Pages) FREESCALE

60 / 71 page

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 8

System Design Information

Freescale Semiconductor

9.8

Thermal Management Information

This section provides thermal management information for the ceramic ball grid array (CBGA) package

for air-cooled applications. Proper thermal control design is primarily dependent on the system-level

design—the heat sink, airflow, and thermal interface material. To reduce the die-junction temperature, heat

sinks may be attached to the package by several methods—spring clip to holes in the printed-circuit board

or package, and mounting clip and screw assembly (see Figure 27); however, due to the potential large

mass of the heat sink, attachment through the printed-circuit board is suggested. If a spring clip is used,

the spring force should not exceed 10 pounds.

Figure 27. Package Exploded Cross-Sectional View with Several Heat Sink Options

The board designer can choose between several types of heat sinks to place on the MPC7457. There are

several commercially available heat sinks for the MPC7457 provided by the following vendors:

Aavid Thermalloy

603-224-9988

80 Commercial St.

Concord, NH 03301

Internet: www.aavidthermalloy.com

Alpha Novatech

408-749-7601

473 Sapena Ct. #15

Santa Clara, CA 95054

Internet: www.alphanovatech.com

Calgreg Thermal Solutions

401-732-8100

60 Alhambra Road

Warwick, RI 02886

Internet: www.calgregthermalsolutions.com

International Electronic Research Corporation (IERC)

818-842-7277

413 North Moss St.

Burbank, CA 91502

Internet: www.ctscorp.com

Thermal

Heat Sink

CBGA Package

Heat Sink

Clip

Printed-Circuit Board

Interface Material

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