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VMV3 датащи(PDF) 101 Page - Microsemi Corporation

номер детали VMV3
подробное описание детали  Military ProASIC3/EL Low Power Flash FPGAs with Flash*Freeze Technology
PDF  212 Pages
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производитель  MICROSEMI [Microsemi Corporation]
домашняя страница  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

VMV3 датащи(HTML) 101 Page - Microsemi Corporation

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Military ProASIC3/EL Low Power Flash FPGAs
Revision 3
2-87
Differential I/O Characteristics
Physical Implementation
Configuration of the I/O modules as a differential pair is handled by Designer software when the user
instantiates a differential I/O macro in the design.
Differential I/Os can also be used in conjunction with the embedded Input Register (InReg), Output
Register (OutReg), Enable Register (EnReg), and Double Data Rate (DDR). However, there is no
support for bidirectional I/Os or tristates with the LVPECL standards.
LVDS
Low-Voltage Differential Signaling (ANSI/TIA/EIA-644) is a high-speed, differential I/O standard. It
requires that one data bit be carried through two signal lines, so two pins are needed. It also requires
external resistor termination.
The full implementation of the LVDS transmitter and receiver is shown in an example in Figure 2-26. The
building blocks of the LVDS transmitter-receiver are one transmitter macro, one receiver macro, three
board resistors at the transmitter end, and one resistor at the receiver end. The values for the three driver
resistors are different from those used in the LVPECL implementation because the output standard
specifications are different.
Along with LVDS I/O, military ProASIC3 also supports Bus LVDS structure and Multipoint LVDS (M-
LVDS) configuration (up to 40 nodes).
Figure 2-26 • LVDS Circuit Diagram and Board-Level Implementation
140
100
Z0 = 50 
Z0 = 50 
165
165
+
P
N
P
N
INBUF_LVDS
OUTBUF_LVDS
FPGA
FPGA
Bourns Part Number: CAT16-LV4F12



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