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VMV3 датащи(PDF) 87 Page - Microsemi Corporation |
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VMV3 датащи(HTML) 87 Page - Microsemi Corporation |
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87 / 212 page ![]() Military ProASIC3/EL Low Power Flash FPGAs Revision 3 2-73 3.3 V PCI, 3.3 V PCI-X Peripheral Component Interface for 3.3 V standard specifies support for 33 MHz and 66 MHz PCI Bus applications. AC loadings are defined per the PCI/PCI-X specifications for the database; Microsemi loadings for enable path characterization are described in Figure 2-15. AC loadings are defined per PCI/PCI-X specifications for the datapath; Microsemi loading for tristate is described in Table 2-114. Table 2-113 • Minimum and Maximum DC Input and Output Levels 3.3 V PCI/PCI-X VIL VIH VOL VOH IOL IOH IOSL IOSH IIL1 IIH2 Drive Strength Min. V Max. V Min. V Max. V Max. V Min. VmA mA Max. mA3 Max. mA3 µA4 µA4 Per PCI specification Per PCI curves 15 15 Notes: 1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL. 2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is larger when operating outside recommended ranges 3. Currents are measured at 100°C junction temperature and maximum voltage. 4. Currents are measured at 125°C junction temperature. Figure 2-15 • AC Loading Test Point Enable Path R to VCCI for tLZ / tZL / tZLS 10 pF for tZH / tZHS / tZL / tZLS 5 pF for tHZ / tLZ R to GND for tHZ / tZH / tZHS R = 1 k Test Point Datapath R = 25 R to VCCI for tDP (F) R to GND for tDP (R) 10 pF Table 2-114 • AC Waveforms, Measuring Points, and Capacitive Loads Input Low (V) Input High (V) Measuring Point* (V) VREF (Typ) (V) CLOAD (pF) 0 3.3 0.285 * VCCI for tDP(R) 0.615 * VCCI for tDP(F) 10 Note: *Measuring point = Vtrip. See Table 2-28 on page 2-27 for a complete table of trip points. |
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