MPC8241EC datasheet(57/58 Pages) FREESCALE

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MPC8241 Integrated Processor Hardware Specifications, Rev. 10

Freescale Semiconductor

Document Revision History

—

Updated document template.

Section 1.4.1.5—Updated driver type names in Table 4 so that they are consistent with the driver

types referred to in the MPC8245 Integrated Processor Reference Manual. Added notes 5 and 6 to

Table 4.

Section 1.4.3.1—Added reference to AN2164 in note 7. Labeled N value in Figures 5 through 8.

Section 1.4.3.2—Updated Figure 9 to show Tos.

Table 9—Changed default for 0x77 bits 5:4 to 0b10.

Section 1.4.3.3—Added item 12e to Table 10 for SDRAM_SYNC_IN to Output Valid Timing.

Updated Figure 13 to state GVDD_OVDD instead of OVDD.

Section 1.5.3—Updated driver type names to match those used in Table 4. Updated notes for the

following signals: DRDY, SDRAM_CLK[0:3], MIV, RTC, TDO, and DA[11].

Section 1.6—Updated PLL table and notes.

Removed old Section 1.7.2 on voltage sequencing requirements. Added cautions regarding voltage

sequencing to the end of Table 2 in Section 1.4.1.2.

Section 1.7.3—Changed sentence recommendation regarding decoupling capacitors.

Section 1.7.5—Added reference to AN2164.

Section 1.7.6—Added sentence regarding the PLL_CFG signals.

Removed old Section 1.7.8 since the MPC8241 cannot be used as a drop in replacement for the

MPC8240 because of pin compatibility issues.

Section 1.7.8—Updated TRST information in this section and Figure 26.

Section 1.7.9—Updated list for heat sink and thermal interface vendors.

Section 1.9—Changed format of ordering information section. Added tables to reflect part number

specifications also available.

Added Sections 1.9.2 and 1.9.3.

0.3

—

Corrected solder ball information in Section 1.5.1 to 62 Sn/36 Pb/2 Ag.

Section 1.4.3.1—Corrected DLL_EXTEND labeling in Figures 5 through 8. Removed note for pin

TRIG_OUT/RCS3 in Table 16, as well as from the list of pins needing to be pulled up to IVDD in

Section 1.7.6.

Corrected order information labeling in Section 1.9 to MPC8241XZPXXXX. Also corrected label

description of ZU = PBGA to ZP = PBGA.

0.2

—

Table 16—Corrected pin number for PLL_CFG0/DA10 to N3. The pin was already correctly listed for

DA10/PLL_CFG0. Updated note 1 to reflect pin assignments for the MPC8241.

Updated footnotes throughout document.

Section 1.4.3.3—Updated note 4 to correct bit values of PCI_HOLD_DEL in PMCR2.

Section 1.6—Updated notes in Table 17. Included memory VCO minimum and maximum numbers.

Section 1.7.8—Updated description of bits PCI_HOLD_DEL in PMCR2.

Section 1.7.10.3—Replaced thermal characterization parameter (YJT) with correct thermal

characterization parameter (

ψJT). Changed ψπ symbol to ψJT.

0.1

—

Updated Features list in Section 1.2.

Corrected pin assignments in Table 16 for DA[15] and DQM[3] signals.

Added vendor (Cool Innovations, Inc.) to list of heat sink vendors.

—

Initial release.

Table 21. Revision History Table (continued)

Revision

Date

Substantive Change(s)

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