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PIC16LC712 датащи(PDF) 92 Page - Microchip Technology |
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PIC16LC712 датащи(HTML) 92 Page - Microchip Technology |
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92 / 106 page ![]() PIC16C712/716 DS41106C-page 92 1999-2013 Microchip Technology Inc. 18-Lead Ceramic Dual In-line with Window (JW) – 300 mil (CERDIP) 3.30 3.56 3.81 5.33 5.08 4.83 .210 .200 .190 W2 Window Length .150 .140 .130 W1 Window Width 10.80 9.78 8.76 .425 .385 .345 eB Overall Row Spacing § 0.53 0.47 0.41 .021 .019 .016 B Lower Lead Width 1.52 1.40 1.27 .060 .055 .050 B1 Upper Lead Width 0.30 0.25 0.20 .012 .010 .008 c Lead Thickness 3.81 3.49 3.18 .150 .138 .125 L Tip to Seating Plane 23.37 22.86 22.35 .920 .900 .880 D Overall Length 7.49 7.37 7.24 .295 .290 .285 E1 Ceramic Pkg. Width 8.26 7.94 7.62 .325 .313 .300 E Shoulder to Shoulder Width 0.76 0.57 0.38 .030 .023 .015 A1 Standoff 4.19 4.06 3.94 .165 .160 .155 A2 Ceramic Package Height 4.95 4.64 4.32 .195 .183 .170 A Top to Seating Plane 2.54 .100 p Pitch 18 18 n Number of Pins MAX NOM MIN MAX NOM MIN Dimension Limits MILLIMETERS INCHES* Units 1 2 D n W2 E1 W1 c eB E p L A2 B B1 A A1 * Controlling Parameter § Significant Characteristic JEDEC Equivalent: MO-036 Drawing No. C04-010 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging |
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