PIC16LC712 datasheet(91/106 Pages) MICROCHIP

номер детали	PIC16LC712

подробное описание детали	8-Bit CMOS Microcontrollers with A/D Converter and Capture/Compare/PWM

PDF	106 Pages

Scroll/Zoom	100%

производитель	MICROCHIP [Microchip Technology]

домашняя страница	http://www.microchip.com

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91 / 106 page

 1999-2013 Microchip Technology Inc.

DS41106C-page 91

PIC16C712/716

18-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)

Foot Angle



804



Mold Draft Angle Bottom



Mold Draft Angle Top

0.51

0.42

0.36

.020

.017

.014

Lead Width

0.30

0.27

0.23

.012

.011

.009

Lead Thickness

1.27

0.84

0.41

.050

.033

.016

Foot Length

0.74

0.50

0.25

.029

.020

.010

Chamfer Distance

11.73

11.53

11.33

.462

.454

.446

Overall Length

7.59

7.49

7.39

.299

.295

.291

Molded Package Width

10.67

10.34

10.01

.420

.407

.394

Overall Width

0.30

0.20

0.10

.012

.008

.004

Standoff

2.39

2.31

2.24

.094

.091

.088

Molded Package Thickness

2.64

2.50

2.36

.104

.099

.093

Overall Height

1.27

.050

Pitch

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units









* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-013

Drawing No. C04-051

§ Significant Characteristic

Note:

For the most current package drawings, please see the Microchip Packaging Specification located

at http://www.microchip.com/packaging

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