SC667201MMG3 datasheet(61/120 Pages) FREESCALE

61 / 120 page

MPC5642A Microcontroller Data Sheet, Rev. 3.1

Freescale Semiconductor

Electrical characteristics

JT = thermal characterization parameter (°C/W)

PD = power dissipation in the package (W)

The thermal characterization parameter is measured in compliance with the JESD51-2 specification using a 40-gauge type T

thermocouple epoxied to the top center of the package case. Position the thermocouple so that the thermocouple junction rests

on the package. Place a small amount of epoxy on the thermocouple junction and approximately 1 mm of wire extending from

the junction. Place the thermocouple wire flat against the package case to avoid measurement errors caused by the cooling

effects of the thermocouple wire.

References:

•

Semiconductor Equipment and Materials International

3081 Zanker Road

San Jose, CA 95134

USA

Phone (+1) 408-943-6900

•

MIL-SPEC and EIA/JESD (JEDEC) specifications available from Global Engineering Documents (phone (+1)

800-854-7179 or (+1) 303-397-7956)

•

JEDEC specifications available on the Web at http://www.jedec.org

•

C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive Engine

Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47-54.

•

G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled Applications”, Electronic

Packaging and Production, pp. 53-58, March 1998.

•

B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and Its Application

in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212-220.

3.4

EMI (electromagnetic interference) characteristics

Table 12. EMI testing specifications1

1 EMI testing and I/O port waveforms per standard IEC 61967-2.

Symbol

Parameter

Conditions

fOSC/fBUS

Frequency

Level

(max)

Unit

VRE_TEM Radiated emissions,

electric field

VDD =5.25V;

TA =+25 °C

150 kHz–30 MHz —

RBW 9 kHz, step size

5kHz

30 MHz–1 GHz —

RBW 120 kHz, step

size 80 kHz

16 MHz crystal

40 MHz bus

No PLL frequency

modulation

150 kHz–50 MHz

dBµV

50–150 MHz

150–500 MHz

500–1000 MHz

IEC Level

—

SAE Level

—

16 MHz crystal

40 MHz bus

±2% PLL frequency

modulation

150 kHz–50 MHz

dBµV

50–150 MHz

150–500 MHz

500–1000 MHz

IEC Level

—

SAE Level

—

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