SC667201MMG3 datasheet(58/120 Pages) FREESCALE

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MPC5642A Microcontroller Data Sheet, Rev. 3.1

Freescale Semiconductor

Electrical characteristics

3.3

Thermal characteristics

Table 9. Thermal characteristics for 176-pin LQFP1

1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.

Symbol

Parameter

Conditions

Value Unit

RJA CC D Junction-to-ambient, natural convection

2 Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board

meets JEDEC specification for this package.

Single-layer board – 1s

°C/W

RJA CC D Junction-to-ambient, natural convection

Four-layer board – 2s2p

°C/W

RJMA CC D Junction-to-moving-air, ambient

at 200 ft./min., single-layer board – 1s

°C/W

CC D

at 200 ft./min., four-layer board – 2s2p

°C/W

RJB CC D Junction-to-board

3 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC

specification for the specified package.

°C/W

RJCtop CC D Junction-to-case

4 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate

temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.

5°C/W



CC D Junction-to-package top, natural convection5

5 Thermal characterization parameter indicating the temperature difference between the package top and the

junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization

parameter is written as Psi-JT.

2°C/W

Table 10. Thermal characteristics for 208-pin MAPBGA1,

1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.

Symbol

Parameter

Conditions

Value Unit

RJA CC D Junction-to-ambient, natural convection

2 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site

(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board

thermal resistance.

Single layer board – 1s3

3 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal

°C/W

CC D

Four layer board – 2s2p4

4 Per JEDEC JESD51-6 with the board horizontal

°C/W

RJMA CC D Junction-to-moving-air, ambient

at 200 ft./min., single-layer board – 1s4

°C/W

CC D

at 200 ft./min., four-layer board – 2s2p

°C/W

RJB CC D Junction-to-board

5 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is

measured on the top surface of the board near the package.

Four-layer board – 2s2p

°C/W

RJC CC D Junction-to-case

6 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate

method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.

6°C/W



CC D Junction-to-package top natural convection7

2°C/W

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