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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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LPC4350 датащи(PDF) 90 Page - NXP Semiconductors |
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LPC4350 датащи(HTML) 90 Page - NXP Semiconductors |
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90 / 145 page  LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Objective data sheet Rev. 2.1 — 23 September 2011 90 of 145 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 9. Thermal characteristics The average chip junction temperature, Tj (C), can be calculated using the following equation: (1) • Tamb = ambient temperature (C), • Rth(j-a) = the package junction-to-ambient thermal resistance (C/W) • PD = sum of internal and I/O power dissipation The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of the I/O pins is often small and many times can be negligible. However it can be significant in some applications. T j T amb P D R th j a – + = Table 7. Thermal characteristics VDD = 2.2 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified; Symbol Parameter Conditions Min Typ Max Unit Tj(max) maximum junction temperature --<tbd> C |
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