5000 datasheet(99/104 Pages) INTEL

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Dual-Core Intel® Xeon® Processor 5000 Series Datasheet

Boxed Processor Specifications

8.2.2

Boxed Processor Heat Sink Weight

8.2.2.1

Thermal Solution Weight

The 1U passive/2U active combination heat sink solution and the 2U passive heat sink

solution will not exceed a mass of 1050 grams. Note that this is per processor, so a dual

processor system will have up to 2100 grams total mass in the heat sinks. This large

mass will require a minimum chassis stiffness to be met in order to withstand force

during shock and vibration.

See Section 3 for details on the processor weight.

8.2.3

Boxed Processor Retention Mechanism and

Heat Sink Support (CEK)

Baseboards and chassis designed for use by a system integrator should include holes

that are in proper alignment with each other to support the boxed processor. Refer to

the Server System Infrastructure Specification (SSI-EEB 3.6, TEB 2.1 or CEB 1.1).

These specification can be found at: http://www.ssiforum.org.

Figure 8-3 illustrates the Common Enabling Kit (CEK) retention solution. The CEK is

designed to extend air-cooling capability through the use of larger heat sinks with

minimal airflow blockage and bypass. CEK retention mechanisms can allow the use of

much heavier heat sink masses compared to legacy limits by using a load path directly

attached to the chassis pan. The CEK spring on the secondary side of the baseboard

provides the necessary compressive load for the thermal interface material. The

baseboard is intended to be isolated such that the dynamic loads from the heat sink are

transferred to the chassis pan via the stiff screws and standoffs. The retention scheme

reduces the risk of package pullout and solder joint failures.

All components of the CEK heat sink solution will be captive to the heat sink and will

only require a Phillips screwdriver to attach to the chassis pan. When installing the

CEK, the CEK screws should be tightened until they will no longer turn easily. This

should represent approximately 8 inch-pounds of torque. Avoid applying more than 10

inch-pounds of torque; otherwise, damage may occur to retention mechanism

components.

8.3

Electrical Requirements

8.3.1

Fan Power Supply (Active CEK)

The 4-pin PWM/T-diode controlled active thermal solution is being offered to help

provide better control over pedestal chassis acoustics. This is achieved though more

accurate measurement of processor die temperature through the processor’s

temperature diode (T-diode). Fan RPM is modulated through the use of an ASIC located

on the baseboard that sends out a PWM control signal to the 4th pin of the connector

labeled as Control. This thermal solution requires a constant +12 V supplied to pin 2 of

the active thermal solution and does not support variable voltage control or 3-pin PWM

control. See Table 8-2 for details on the 4-pin active heat sink solution connectors.

If the 4-pin active fan heat sink solution is connected to an older 3-pin baseboard CPU

fan header it will default back to a thermistor controlled mode, allowing compatibility

with legacy 3-wire designs. When operating in thermistor controlled mode, fan RPM is

automatically varied based on the TINLET temperature measured by a thermistor

located at the fan inlet of the heat sink solution.

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