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Dual-Core Intel® Xeon® Processor 5000 Series Datasheet

Thermal Specifications

6.1

Package Thermal Specifications

The Dual-Core Intel Xeon Processor 5000 series require a thermal solution to maintain

temperatures within its operating limits. Any attempt to operate the processor outside

these operating limits may result in permanent damage to the processor and

potentially other components within the system. As processor technology changes,

thermal management becomes increasingly crucial when building computer systems.

Maintaining the proper thermal environment is key to reliable, long-term system

operation.

A complete solution includes both component and system level thermal management

features. Component level thermal solutions can include active or passive heatsinks

attached to the processor integrated heat spreader (IHS). Typical system level thermal

solutions may consist of system fans combined with ducting and venting.

This section provides data necessary for developing a complete thermal solution. For

more information on designing a component level thermal solution, refer to the Dual-

Core Intel® Xeon® Processor 5000 Series Thermal/Mechanical Design Guidelines.

Note:

The boxed processor will ship with a component thermal solution. Refer to Chapter 8,

“Boxed Processor Specifications”for details on the boxed processor.

6.1.1

Thermal Specifications

To allow the optimal operation and long-term reliability of Intel processor-based

systems, the processor must remain within the minimum and maximum case

temperature (TCASE) specifications as defined by the applicable thermal profile (refer to

Table 6-1, Table 6-4 and Table 6-7; Figure 6-1, Figure 6-2 and Figure 6-3). Thermal

solutions not designed to provide this level of thermal capability may affect the long-

term reliability of the processor and system. For more details on thermal solution

design, please refer to the processor thermal/mechanical design guidelines.

The Dual-Core Intel Xeon Processor 5000 series implement a methodology for

managing processor temperatures, which is intended to support acoustic noise

reduction through fan speed control and to ensure processor reliability. Selection of the

appropriate fan speed is based on the temperature reported by the processor’s Thermal

Diode. If the diode temperature is greater than or equal to Tcontrol (refer to

Section 6.2.6), then the processor case temperature must remain at or below the

temperature specified by the thermal profile (refer to Figure 6-1, Figure 6-2 and

Figure 6-3). If the diode temperature is less than Tcontrol, then the case temperature

is permitted to exceed the thermal profile, but the diode temperature must remain at

or below Tcontrol. Systems that implement fan speed control must be designed to take

these conditions into account. Systems that do not alter the fan speed only need to

guarantee the case temperature meets the thermal profile specifications.

Intel has developed two thermal profiles, either of which can be implemented with the

Dual-Core Intel Xeon Processor 5000 series. Both ensure adherence to Intel reliability

requirements. Thermal Profile A (refer to Figure 6-1, Figure 6-2; Table 6-2 and

Table 6-5) is representative of a volumetrically unconstrained thermal solution (that is,

industry enabled 2U heatsink). In this scenario, it is expected that the Thermal Control

Circuit (TCC) would only be activated for very brief periods of time when running the

most power intensive applications. Thermal Profile B (refer to Figure 6-1 and

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