5000 datasheet(101/104 Pages) INTEL

101 / 104 page

Dual-Core Intel® Xeon® Processor 5000 Series Datasheet

101

Boxed Processor Specifications

8.3.2.1

1U Passive/2U Active Combination Heat Sink Solution (1U Rack

Passive)

In the 1U configuration it is assumed that a chassis duct will be implemented to provide

sufficient airflow to pass through the heat sink fins. Currently the actual airflow target

is within the range of 15-27 CFM. The duct should be designed as precisely as possible

and should not allow any air to bypass the heat sink (0” bypass) and a back pressure of

0.38 in. H2O. It is assumed that a 40°C TLA is met. This requires a superior chassis

design to limit the TRISE at or below 5°C with an external ambient temperature of 35°C.

Following these guidelines will allow the designer to meet Thermal Profile B and

conform to the thermal requirements of the processor.

8.3.2.2

1U Passive/2U Active Combination Heat Sink Solution (Pedestal

Active)

The active configuration of the combination solution is designed to help pedestal

chassis users to meet the thermal processor requirements without the use of chassis

ducting. It may be still be necessary to implement some form of chassis air guide or air

duct to meet the TLA temperature of 40°C depending on the pedestal chassis layout.

Also, while the active thermal solution is designed to mechanically fit into a 2U

volumetric, it may require additional space at the top of the thermal solution to allow

sufficient airflow into the heat sink fan. Therefore, additional design criteria may need

to be considered if this thermal solution is used in a 2U rack mount chassis, or in a

chassis that has drive bay obstructions above the inlet to the fan heat sink. Use of the

active configuration in rackmount chassis is not recommended.

It is recommended that the ambient air temperature outside of the chassis be kept at

or below 35°C. The air passing directly over the processor thermal solution should not

be preheated by other system components. Meeting the processor’s temperature

specification is the responsibility of the system integrator.

8.3.2.3

2U Passive Heat Sink Solution (2U+ Rack or Pedestal)

A chassis duct is required for the 2U passive heat sink. In this configuration the thermal

profile (see Section 6) should be followed by supplying 27 CFM of airflow through the

fins of the heat sink with a 0” or no duct bypass and a back pressure of 0.182 in. H2O.

The TLA temperature of 40°C should be met. This may require the use of superior

design techniques to keep TRISE at or below 5°C based on an ambient external

temperature of 35°C.

8.4

Boxed Processor Contents

A direct chassis attach method must be used to avoid problems related to shock and

vibration, due to the weight of the thermal solution required to cool the processor. The

board must not bend beyond specification in order to avoid damage. The boxed

processor contains the components necessary to solve both issues. The boxed

processor will include the following items:

• Dual-Core Intel Xeon Processor 5000 series

• Unattached Heat Sink Solution

• 4 screws, 4 springs, and 4 heat sink standoffs (all captive to the heat sink)

• Thermal Interface Material (pre-applied on heat sink)

• Installation Manual

•Intel Branding Logo

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