PCF2123TS datasheet(44/55 Pages) NXP

номер детали	PCF2123TS

подробное описание детали	SPI Real time clock/calendar

PDF	55 Pages

Scroll/Zoom	100%

производитель	NXP [NXP Semiconductors]

домашняя страница	http://www.nxp.com

Logo

44 / 55 page

PCF2123_2

Product data sheet

Rev. 02 — 4 December 2009

44 of 55

NXP Semiconductors

PCF2123

SPI Real time clock/calendar

15. Bare die outline

Fig 32. Bare die outline of PCF2123U/10

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

PCF2123U/10

Wire bond die; 12 bonding pads; 1.492 x 1.449 x 0.20 mm

PCF2123U/10

08-07-16

08-07-24

UNIT

nom

0.20

1.492

1.296

0.09

0.081

0.09

DIMENSIONS (mm are the original dimensions)

D(1)

E(1)

1.449

P1(2)

P2(3)

P3(2)

P4(3)

0.081

scale

1 mm

Notes

1. Dimension includes saw lane

2. P1 and P3: pad size

3. P2 and P4: passivation opening

P4 P3

detail X

Table 46.

Bonding pad locations

All x/y coordinates represent the position of the center of each pad with respect to the center

(x/y = 0) of the chip; see Figure 32.

Symbol

Pad

Coordinates

SDO

648.0

−575.0

SDI

648.0

−377.0

SCL

648.0

−179.0

CLKOE

648.0

171.2

CLKOUT

648.0

369.2

VDD

648.0

625.7

OSCI

−648.0

639.0

OSCO

−648.0

421.9

TEST

−648.0

−25.9

INT

−648.0

−223.9

−648.0

−441.0

VSS

−648.0

−639.0

PCF2123TS датащи(PDF) 44 Page - NXP Semiconductors

PCF2123TS датащи(HTML) 44 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55

датащи скачать

ссылки URL