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MSC7119 датащи(PDF) 55 Page - Freescale Semiconductor, Inc |
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MSC7119 датащи(HTML) 55 Page - Freescale Semiconductor, Inc |
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55 / 60 page ![]() Hardware Design Considerations MSC7119 Data Sheet, Rev. 8 Freescale Semiconductor 55 3.5.1 VREF and VTT Design Constraints VTT and VREF are isolated power supplies at the same voltage, with VTT as a high current power source. This section outlines the voltage supply design needs and goals: • Minimize the noise on both rails. •VTT must track variation in the VREF DC offsets. Although they are isolated supplies, one possible solution is to use a single IC to generate both signals. • Both references should have minimal drift over temperature and source supply. • It is important to minimize the noise from coupling onto VREF as follows: — Isolate VREF and shield it with a ground trace. — Use 15–20 mm track. — Use 20–30 mm clearance between other traces for isolating. — Use the outer layer route when possible. — Use distributed decoupling to localize transient currents and return path and decouple with an inductance less than 3 nH. • Max source/sink transient currents of up to 1.8 A for a 32-bit data bus. • Use a wide island trace on the outer layer: — Place the island at the end of the bus. — Decouple both ends of the bus. — Use distributed decoupling across the island. — Place SSTL termination resistors inside the VTT island and ensure a good, solid connection. • Place the VTT regulator as closely as possible to the termination island. — Reduce inductance and return path. — Tie current sense pin at the midpoint of the island. 3.5.2 Decoupling The DDR decoupling considerations are as follows: • DDR memory requires significantly more burst current than previous SDRAMs. • In the worst case, up to 64 drivers may be switching states. • Pay special attention and decouple discrete ICs per manufacturer guidelines. • Leverage VTT island topology to minimize the number of capacitors required to supply the burst current needs of the termination rail. • See the Micron DesignLine publication entitled Decoupling Capacitor Calculation for a DDR Memory Channel (http://download.micron.com/pdf/pubs/designline/3Q00dl1-4.pdf). Figure 37. SSTL Power Value Driver Receiver VREF VDDQ VSS VTT RS RT |
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