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MSC7119 датащи(PDF) 27 Page - Freescale Semiconductor, Inc |
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MSC7119 датащи(HTML) 27 Page - Freescale Semiconductor, Inc |
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27 / 60 page ![]() Electrical Characteristics MSC7119 Data Sheet, Rev. 8 Freescale Semiconductor 27 Figure 6 shows the DDR DRAM output timing diagram. 209 Dn/DQMn output setup with respect to DQSn3 tDDKHDS, tDDKLDS 0.25 × tCK – 750 — ps 210 Dn/DQMn output hold with respect to DQSn3 tDDKHDX, tDDKLDX 0.25 × tCK – 750 — ps 211 DQSn preamble start4 tDDKHMP –0.25 × tCK —ps 212 DQSn epilogue end5 tDDKHME –600 600 ps Notes: 1. All CK/CK referenced measurements are made from the crossing of the two signals ±0.1 V. 2. tDDKHMH can be modified through the TCFG2[WRDD] DQSS override bits. The DRAM requires that the first write data strobe arrives 75–125% of a DRAM cycle after the write command is issued. Any skew between DQSn and CK must be considered when trying to achieve this 75%–125% goal. The TCFG2[WRDD] bits can be used to shift DQSn by 1/4 DRAM cycle increments. The skew in this case refers to an internal skew existing at the signal connections. By default, the CK/CK crossing occurs in the middle of the control signal (An/RAS/CAS/WE/CKE) tenure. Setting TCFG2[ACSM] bit shifts the control signal assertion 1/2 DRAM cycle earlier than the default timing. This means that the signal is asserted no earlier than 600 ps before the CK/CK crossing and no later than 600 ps after the crossing time; the device uses 1200 ps of the skew budget (the interval from –600 to +600 ps). Timing is verified by referencing the falling edge of CK. See Chapter 10 of the MSC711x Reference Manual for details. 3. Determined by maximum possible skew between a data strobe (DQS) and any corresponding bit of data. The data strobe should be centered inside of the data eye. 4. Please note that this spec is in reference to the DQSn first rising edge. It could also be referenced from CK(r), but due to programmable delay of the write strobes (TCFG2[WRDD]), there pre-amble may be extended for a full DRAM cycle. For this reason, we reference from DQSn. 5. All outputs are referenced to the rising edge of CK. Note that this is essentially the CK/DQSn skew in spec 208. In addition there is no real “maximum” time for the epilogue end. JEDEC does not require this is as a device limitation, but simply for the chip to guarantee fast enough write-to-read turn-around times. This is already guaranteed by the memory controller operation. Figure 6. DDR DRAM Output Timing Diagram Table 18. DDR DRAM Output AC Timing (continued) No. Parameter Symbol Min Max Unit An Dn DQSn CK CK D1 D0 Write A0 NOOP RAS CAS WE CKE 200 208 209 209 212 210 210 211 206 204 207 205 DQMn |
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