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AT25DF021A-DWFHT датащи(PDF) 56 Page - Renesas Technology Corp

номер детали AT25DF021A-DWFHT
подробное описание детали  2-Mbit, 1.65 V Minimum SPI Serial Flash Memory with Dual-I/O Support
PDF  59 Pages
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производитель  RENESAS [Renesas Technology Corp]
домашняя страница  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

AT25DF021A-DWFHT датащи(HTML) 56 Page - Renesas Technology Corp

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DS-AT25DF021A-042 Rev. L
Page 56
8/7/23
© 2023 Renesas Electronics
AT25DF021A Datasheet
17.4 8X-TSSOP
1
E
N
TOP VIEW
SIDE VIEW
END VIEW
1. This drawing is for general information only.
Refer to JEDEC Drawing MO-153. Variation AA, for proper
dimensions, tolerances, daturns, etc.
2. Dimension D does not include mold Flash, protrusions or
gate burrs. Mold Flash, protrusions and gate burrs shall not
exceed 0.15mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or
protrusions, Inter-lead Flash and protrusions shall not
exceed 0.2 5mm (0.01 in) per side.4. Dimension b does not
include Dambar protrusion. Allowable Dambar protrusion
shall be 0.08 mm total in excess of the b dimension at
maximum material condition. Damber cannot be located on
the lower redius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
L
Notes:
C
SYMBOL
MIN
NOM
MAX
NOTE
A
A1
A2
D
E
E1
b
L
--
0.05
0.80
2.90
4.30
0.19
0.45
1.20
0.15
1.05
3.10
6.40 BSC
4.50
0.30
0.75
0.65 BSC
1.00 REF
COMMON DIMENSIONS
(Unit of Measure = mm)
e
GPC
TNR
DRAWING NO.
8X
REV.
E
TITLE
E1
Pin 1 indicator
this corner
b
D
e
A
A1
A2
L1
C
2, 5
3, 5
4
0.60
0.09
0.20
4.40
3.00
1.00
H
L1
8X, 8-lead 4.4 mm Body. Plastic Thin
Shrink Small Outline Package (TSSOP)



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