ADRV9002BBCZ datasheet(21/100 Pages) AD

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Data Sheet

ADRV9002

ABSOLUTE MAXIMUM RATINGS

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Rev. A | 21 of 100

Table 13.

Parameter

Rating

VDDA_1P0 to VSSA

−0.2 V to +1.2 V

VDDA_1P3 to VSSA

−0.2 V to +1.5 V

VDDA_1P8 to VSSA

−0.3 V to +2.2 V

VDD_1P0 to VSSD

−0.2 V to +1.2 V

VDD_1P8 to VSSD

−0.3 V to +2.2 V

Input Current to Any Pin Except Supplies

±10 mA

Maximum Input Power into RF Ports

See Table 14 for limits vs.

survival time

Junction Temperature Range

−40°C to +110°C

Storage Temperature Range

−65°C to +150°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

Table 14. Maximum Input Power into RF Ports vs. Lifetime

RF Port Input Power,

Continuous Wave Signal (dBm)

Lifetime

30 dB of

Attenuation from

Maximum Gain

0 dB of Attenuation

from Maximum Gain

>10 years

20000 hours

>10 years

14 hours

>10 years

110 minutes

>7 years

60 minutes

REFLOW PROFILE

The ADRV9002 reflow profile is in accordance with the JEDEC

JESD20 criteria for Pb-free devices. The maximum reflow tempera-

ture is 260°C.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

The thermal resistance values specified in Table 15 are calculated

based on JEDEC specifications (unless specified otherwise) and

must be used in compliance with JESD51-12. Note that using

enhanced heat removal techniques (PCB, heat sink, airflow, and so

on) improves thermal resistance.

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

θJC_TOP is the thermal resistance from the junction to the top of the

package case.

Table 15. Thermal Resistance Values1, 2

Package Type

θJA

θJC_TOP θJB

ΨJC

ΨJB

Unit

BC-196-16

18.21

0.04

3.96

0.02

3.63

°C/W

1 For test, 100 μm thermal interface material (TIM) is used. TIM is assumed to

have 3.6 W/mK.

2 Using enhanced heat removal (PCB, heat sink, airflow, and so on) techniques

improve thermal resistance values.

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD-sen-

sitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

Charged device model (CDM) per ANSI/ESDA/JEDEC JS-002.

ESD Ratings for ADRV9002

Table 16. ADRV9002, 196-Ball CSP_BGA

ESD Model

Withstand Threshold (V)

Class

HBM

2000

CDM

350

CDM (Excluding

AUXADC_2)

500

C2A

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

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