TSI721 datasheet(64/67 Pages) RENESAS

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Tsi721 Datasheet

April 4, 2016

Integrated Device Technology

4.3

Thermal Characteristics

Heat generated by the packaged silicon must be removed from the package to ensure the silicon is maintained within its

functional and maximum design temperature limits. If heat buildup becomes excessive, the silicon temperature may exceed

the temperature limits. A consequence of this is that the silicon may fail to meet the performance specifications and the

reliability objectives may be affected.

Failure mechanisms and failure rate of a device has an exponential dependence on the silicon operating temperatures.

Therefore, the control of the package, and by extension the junction temperature, is essential to ensure product reliability. The

Tsi721 is specified safe for operation when the junction temperature is within the recommended limits as displayed in Table 12.

Table 38 shows the simulated thermal characteristic (Theta JB and Theta JC) of the Tsi721 package.

Table 39 shows the simulated junction to ambient characteristics of the Tsi721. The thermal resistance Theta JA

characteristics of a package depends on multiple variables other than just the package. In a typical application, designers must

consider various system-level and environmental characteristics, such as:

• Package mounting (vertical/horizontal)

• System airflow conditions (laminar/turbulent)

• Heat sink design and thermal characteristics

• Heat sink attachment method

• PWB size, layer count, and conductor thickness

• Influence of the heat dissipating components assembled on the PWB (neighboring effects)

The results in Table 39 are based on a JEDEC Thermal Test Board configuration (JESD51-9), and do not factor in the

system-level characteristics described above. As such, these values are for reference only.

4.4

Moisture Sensitivity

The moisture sensitivity level (MSL) for the Tsi721 is 4.

Table 38: Junction to Ambient Characteristics – Theta JB/JC

Interface

Results (C/W)

Theta JB

8.78

Theta JC

0.11

Table 39: Junction to Ambient Characteristics – Theta JA

Device

Theta JA (C/W)

0 m/s

1 m/s

2 m/s

Tsi721

13.1

12.06

11.4

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