SPC574S60 datasheet(73/77 Pages) STMICROELECTRONICS

73 / 77 page

DS10601 Rev 6

73/77

SPC574Sx

Revision history

13-Apr-2015

Updated Table 35: ADC input leakage current

Table 36: ADC conversion characteristics

– Changed values for IADCVDDIADV_S

– Added footnotes for VSS_HV_ADR and IADCREFH

Removed IADCREFL, TUE10

Renamed Figure 10 to include BGA244

Added Figure 10: ADC decoupling capacitance/resistance scheme

Added Section :

Removed subsections of Section 2.2: Pin descriptions with referral to the “Signal

description” chapter in the devices’ reference manual

Added Section 3.4: Electromagnetic compatibility (EMC)

Added Section 3.5: Electrostatic discharge (ESD)

Updated the tables in Section 3.7: Thermal characteristics

Updated Section 3.11: Power management

Added Section 3.12: PMU monitor specifications

Added Section 3.16: External oscillator (XOSC) electrical characteristics

Added Section 3.19: Temperature sensor

Added Section 3.20: JTAG interface timings

Added Section 3.21: Nexus interface timing

11-Jan-2016

Figure 1: Block diagram: added missing CMU4 block.

Figure 3: 244-ball BGA pinout (top view): updated pin names for A10, A11, A13, B12,

B16, C18, D4, D15, D18, E18, F18, and K18

Table 21: eTQFP100 HV/LV supply decoupling capacitances, Table 25: eTQFP144

HV/LV supply decoupling capacitances and Table 26: BGA244 HV/LV supply

decoupling capacitances: correction for VDD_LV_S2 pad name

Table 30: Flash memory program and erase specifications and Table 29: Flash

memory Life Specification: removed the mention “(pending silicon Qualification)”

Figure 42: eTQFP100 mechanical data and Figure 49: eTQFP144 mechanical data:

updated D2 and E2 values

Table 43. Document revision history (continued)

Date

Revision

Changes

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