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SPC574S60 датащи(PDF) 70 Page - STMicroelectronics

номер детали SPC574S60
подробное описание детали  32-bit Power Architecture microcontroller for automotive ASILD applications
PDF  77 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
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SPC574S60 датащи(HTML) 70 Page - STMicroelectronics

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Package information
SPC574Sx
70/77
DS10601 Rev 6
3. A1 is defined as the distance from the seating plane to the lowest point on the package body.
4. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall not cause the lead width to exceed
the maximum “b” dimension by more than 0.08 mm. Dambar cannot be located on the lower radius or the foot. Minimum
space between protrusion and an adjacent lead is 0.07 mm for 0.4 mm and 0.5 mm pitch packages.
5. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip.
6. To be determined at seating datum plane C.
7. The Top package body size may be smaller than the bottom package size by as much as 0.15 mm.
8. Dimensions D1 and E1 do not include mold flash or protrusions. Allowable mold flash or protrusions is “0.25 mm” per side.
D1 and E1 are maximum plastic body size dimensions including mold mismatch.
9. Dimensions D2 and E2 show the maximum exposed metal area on the package surface where the exposed pad is located
(if present). It includes all metal protrusions from exposed pad itself.
10. Dimensions D3 and E3 show the minimum solderable area, defined as the portion of exposed pad which is guaranteed to
be free from resin flashes/bleeds, bordered by internal edge of inner groove.
11. “N” is the number of terminal positions for the specified body size.
12. Dimensioning and tolerancing schemes conform to ASME Y14.5M-1994.
13. All Dimensions are in millimeters.
14. For Symbols, Recommended Values and Tolerances see Table below:
Symbol
Definition
Notes
aaa
The tolerance that controls the position of the
terminal pattern with respect to Datum A and B. The
center of the tolerance zone for each terminal is
defined by basic dimension e as related to Datum A
and B.
For flange-molded packages, this tolerance also
applies for basic dimensions D1 and E1. For
packages tooled with intentional terminal tip
protrusions, aaa does not apply to those
protrusions.
bbb
The bilateral profile tolerance that controls the
position of the plastic body sides. The centers of the
profile zones are defined by the basic dimensions D
and E.
ccc
The unilateral tolerance located above the seating
plane where in the bottom surface of all terminals
must be located.
This tolerance is commonly know as the
“coplanarity” of the package terminals.
ddd
The tolerance that controls the position of the
terminals to each other. The centers of the profile
zones are defined by basic dimension e.
This tolerance is normally compounded with
tolerance zone defined by “b”.



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