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25CSM04 датащи(PDF) 41 Page - Microchip Technology |
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25CSM04 датащи(HTML) 41 Page - Microchip Technology |
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41 / 55 page ![]() 2019-2022 Microchip Technology Inc. and its subsidiares DS20005817D-page 41 25CSM04 12.0 PACKAGING INFORMATION 12.1 Package Marking Information Part Number 1st Line Marking Codes SOIC TDFN-S CSP 25CSM04 25CSM04 25CSM04 25CSM04 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code * This package is RoHs compliant. The JEDEC® designator can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 8-Pad 5x6 TDFN-S Example 8-Lead SOIC Example 25CSM04 SN2211 13F 25CSM04 XXXXXXX 25CSM04 MF 221113F XXYYWW YYWWNNN 8-Ball CSP Example 25CSM04 XXXXXXX 25CSM04 CS0668MY 221113F YYWWNNN |
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