SPC582BX datasheet(24/115 Pages) STMICROELECTRONICS

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Electrical characteristics

SPC582Bx

24/115

DS11597 Rev 4

4.8

I/O pad specification

The following table describes the different pad type configurations.

Note:

Each I/O pin on the device supports specific drive configurations. See the signal description

table in the device reference manual for the available drive configurations for each I/O pin.

PMC_DIG_VSIO register has to be configured to select the voltage level (3.3 V or 5.0 V) for

each IO segment.

Logic level is configurable in running mode while it is TTL not-configurable in STANDBY for

LP (low power) pads, so if a LP pad is used to wakeup from STANDBY, it should be

configured as TTL also in running mode in order to prevent device wrong behavior in

STANDBY.

4.8.1

I/O input DC characteristics

The following table provides input DC electrical characteristics, as described in Figure 3.

Table 9. I/O pad specification descriptions

Pad type

Description

Weak configuration

Provides a good compromise between transition time and low electromagnetic emission.

Medium configuration

Provides transition fast enough for the serial communication channels with controlled

current to reduce electromagnetic emission.

Strong configuration

Provides fast transition speed; used for fast interface.

Very strong

configuration

Provides maximum speed and controlled symmetric behavior for rise and fall transition.

Used for fast interface requiring fine control of rising/falling edge jitter.

Input only pads

These low input leakage pads are associated with the ADC channels.

Standby pads

Some pads are active during Standby. Low Power Pads input buffer can only be

configured in TTL mode. When the pads are in Standby mode, the Pad-Keeper feature is

activated: if the pad status is high, the weak pull-up resistor is automatically enabled; if

the pad status is low, the weak pull-down resistor is automatically enabled.

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