SPC582BX datasheet(85/115 Pages) STMICROELECTRONICS

85 / 115 page

DS11597 Rev 4

85/115

SPC582Bx

Package information

5.1.1

Package mechanical drawings and data information

The following notes are related to Figure 30, Figure 31, Figure 32 and Table 46:

Dimensioning and tolerancing schemes conform to ASME Y14.5M-1994.

The Top package body size may be smaller than the bottom package size by as much

as 0.15 mm.

Datums A-B and D to be determined at datum plane H.

To be determined at seating datum plane C.

Dimensions D1 and E1 do not include mold flash or protrusions. Allowable mold flash

or protrusions is “0.25 mm” per side. D1 and E1 are Maximum plastic body size

dimensions including mold mismatch.

Details of pin 1 identifier are optional but must be located within the zone indicated.

All dimensions are in millimeter except where explicitly noted.

No intrusion allowed inwards the leads.

Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall

not cause the lead width to exceed the maximum “b” dimension by more than 0.08 mm.

Dambar cannot be located on the lower radius or the foot. Minimum space between

protrusion and an adjacent lead is 0.07 mm for 0.4 mm and 0.5 mm pitch packages.

10. Exact shape of each corner is optional.

11. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm

from the lead tip.

12. A1 is defined as the distance from the seating plane to the lowest point on the package

body.

13. Dimensions D2 and E2 show the maximum exposed metal area on the package

surface where the exposed pad is located (if present). It includes all metal protrusions

from exposed pad itself. Type of exposed pad on SPC582Bx is as Figure 33. End user

should verify D2 and E2 dimensions according to the specific device application.

14. Dimensions D3 and E3 show the minimum solderable area, defined as the portion of

exposed pad which is guaranteed to be free from resin flashes/bleeds, bordered by

internal edge of inner groove.

15. The optional exposed pad is generally coincident with the top or bottom side of the

package and not allowed to protrude beyond that surface.

16. “N” is the max number of terminal positions for the specified body size.

17. Critical dimensions:

Stand-Off

Overall Width

Lead Coplanarity

18. For symbols, recommended values and tolerances, see Table 47.

19. Notch may be present in this area (MAX 1.5mm square) if center top gate molding

technology is applied. Resin gate residual not protruding out of package top surface.

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