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STM32G070CB датащи(PDF) 90 Page - STMicroelectronics |
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STM32G070CB датащи(HTML) 90 Page - STMicroelectronics |
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90 / 93 page ![]() STM32G070CB/KB/RB 90/93 DS12766 Rev 2 6.4 Thermal characteristics The operating junction temperature TJ must never exceed the maximum given in The maximum junction temperature in °C that the device can reach if respecting the operating conditions, is: TJ(max) = TA(max) + PD(max) x ΘJA where: TA(max) is the maximum operating ambient temperature in °C, ΘJA is the package junction-to-ambient thermal resistance, in °C/W, PD = PINT + PI/O, –PINT is power dissipation contribution from product of IDD and VDD –PI/O is power dissipation contribution from output ports where: PI/O = Σ (VOL × IOL) + Σ ((VDDIO1 – VOH) × IOH), taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the application. 6.4.1 Reference document JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (still air). Available from www.jedec.org. Table 20: General operating conditions. Table 68. Package thermal characteristics Symbol Parameter Package Value Unit ΘJA Thermal resistance junction-ambient LQFP64 10 × 10 mm 65 °C/W LQFP48 7 × 7 mm 75 LQFP32 7 × 7 mm 76 |
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