LPC81XM datasheet(32/78 Pages) NXP

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LPC81XM

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Product data sheet

Rev. 4.6 — 4 April 2018

32 of 78

NXP Semiconductors

LPC81xM

32-bit ARM Cortex-M0+ microcontroller

10. Thermal characteristics

The average chip junction temperature, Tj (C), can be calculated using the following

equation:

(1)

• Tamb = ambient temperature (C),

• Rth(j-a) = the package junction-to-ambient thermal resistance (C/W)

• PD = sum of internal and I/O power dissipation

The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of

the I/O pins is often small and many times can be negligible. However it can be significant

in some applications.

Table 8.

Thermal resistance

Symbol Parameter

Conditions

Max/Min

Unit

DIP8

Rth(j-a)

thermal resistance from

junction to ambient

JEDEC (4.5 in

 4 in); still air

60 ± 15 %

C/W

Single-layer (4.5 in

 3 in); still air 81 ± 15 % C/W

Rth(j-c)

thermal resistance from

junction to case

38 ± 15 %

C/W

TSSOP16

Rth(j-a)

thermal resistance from

junction to ambient

JEDEC (4.5 in

 4 in); still air

133 ± 15 %

C/W

Single-layer (4.5 in

 3 in); still air 182 ± 15 % C/W

Rth(j-c)

thermal resistance from

junction to case

33 ± 15 %

C/W

TSSOP20

Rth(j-a)

thermal resistance from

junction to ambient

JEDEC (4.5 in

 4 in); still air

110 ± 15 %

C/W

Single-layer (4.5 in

 3 in); still air 153 ± 15 % C/W

Rth(j-c)

thermal resistance from

junction to case

23 ± 15 %

C/W

SO20

Rth(j-a)

thermal resistance from

junction to ambient

JEDEC (4.5 in

 4 in); still air

87 ± 15 %

C/W

Single-layer (4.5 in

 3 in); still air 112 ± 15 % C/W

Rth(j-c)

thermal resistance from

junction to case

50 ± 15 %

C/W

XSON16

Rth(j-a)

thermal resistance from

junction to ambient

JEDEC (4.5 in

 4 in); still air

92 ± 15 %

C/W

Single-layer (4.5 in

 3 in); still air 180 ± 15 % C/W

Rth(j-c)

thermal resistance from

junction to case

27 ± 15 %

C/W

amb

th j

–

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