LM2633 datasheet(14/40 Pages) NSC

14 / 40 page

Electrical Characteristics (Continued)

CC = +15V unless otherwise indicated under the Conditions column. Typicals and limits appearing in plain type apply for TA

J = +25˚C. Limits appearing in boldface type apply over −40˚C to +125˚C.

Symbol

Parameter

Conditions

Min

Typ

Max

Units

Error Amplifier

fb2

Feedback Input Bias

Current, Channel 2

FB2 = 1.36V

fb3

Feedback Input Bias

Current, Channel 3

FB3 = 1.36V

comp1,

comp2

COMP Output Sink

Current

FB1 = 150% of measured 1.4V DAC,

FB2 = 150% of measured bandgap,

COMP1 =VCOMP2 =1V

µA

comp_max

COMP Pin Maximum

Voltage

tbd

1.96

Transconductance

576

µmho

DAC Output and V

FB2

∆V

dac

Channel 1 DAC Output

Voltage Accuracy

VCOMP1 = 1V, DAC codes from 1.3V

to 1.6V

−2.0

2.0

VCOMP1 = 1V, DAC codes from

0.925V to 1.25V and from 1.65V to

2.00V

−2.2

2.2

fb2

Channel 2 DC Output

Voltage Accuracy

COMP2 pin from 0.5V to 1.8V

1.212

1.238

1.264

Linear Regulator Controller

fb3

Channel 3 DC Output

Voltage Accuracy

1.209

1.24

1.271

g3_sk

G3 Sink Current

µA

g3_sc

G3 Minimum Source

Current

g3_max

G3 Maximum Voltage

3.6

Logic Inputs and Outputs

Minimum High Level

Input Voltage (FPWM,

VID0-VID4)

2.2

Maximum Low Level

Input Voltage (FPWM,

ON/SS1, ON/SS2,

VID0-VID4)

0.7

oh_pg

PGOOD Output High

Current

PGOOD = 5.7V (Note 23)

5µA

ol_pg

PGOOD Output Low

Voltage

PGOOD Sinking 20 µA

0.3

Note 11: Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the

device is guaranteed. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics table.

Note 12: Maximum allowable power dissipation is calculated by using PDMAX =(TJMAX -TA)/θJA, where TJMAX is the maximum junction temperature, TA is the

ambient temperature and

θJA is the junction-to-ambient thermal resistance of the specified package. The 1.56W rating results from using 150˚C, 25˚C, and 80˚C/W

for TJMAX,TA, and θJA respectively. A θJA of 90˚C/W represents the worst-case condition of no heat sinking of the 48-pin TSSOP. Heat sinking allows the safe

dissipation of more power. The Absolute Maximum power dissipation should be derated by 12.5mW per ˚C above 25˚C ambient. The LM2633 actively limits its

junction temperature to about 150˚C.

Note 13: For detailed information on soldering plastic small-outline packages, refer to the Packaging Databook available from National Semiconductor Corporation.

Note 14: Except for ILIM1 and ILIM2 pins, which are 1.5kV. For testing purposes, ESD was applied using the human-body model, a 100pF capacitor discharged

through a 1.5k

Ω resistor.

Note 15: A typical is the center of characterization data taken with TA =TJ = 25˚C. Typical data are not guaranteed.

Note 16: All limits are guaranteed. All electrical characteristics having room-temperature limits are tested during production with TA =TJ = 25˚C. All hot and cold

limits are guaranteed by correlating the electrical characteristics to process and temperature variations and applying statistical process control.

Note 17: This test simulates heavy load condition by changing COMP pin voltage.

Note 18: This parameter indicates how much current the LM2633 is drawing from the input supply when it is functioning but not driving external MOSFETs or a

bipoloar transistor.

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