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STM32L081CB датащи(PDF) 105 Page - STMicroelectronics |
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STM32L081CB датащи(HTML) 105 Page - STMicroelectronics |
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105 / 110 page ![]() DocID027513 Rev 4 105/110 STM32L081xx Package information 107 7.4 Thermal characteristics The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated using the following equation: TJ max = TA max + (PD max × JA) Where: TA max is the maximum ambient temperature in C, JA is the package junction-to-ambient thermal resistance, in C/W, PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax), PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip internal power. PI/O max represents the maximum power dissipation on output pins where: PI/O max = (VOL × IOL) + ((VDD – VOH) × IOH), taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the application. Figure 40. Thermal resistance Table 74. Thermal characteristics Symbol Parameter Value Unit JA Thermal resistance junction-ambient LQFP48 - 7 x 7 mm / 0.5 mm pitch 54 °C/W Thermal resistance junction-ambient UFQFPN32 - 5 x 5 mm / 0.5 mm pitch 36 Thermal resistance junction-ambient LQFP32 - 7 x 7 mm / 0.8 mm pitch 60 |
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