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TMS320VC5509 датащи(PDF) 78 Page - Texas Instruments |
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TMS320VC5509 датащи(HTML) 78 Page - Texas Instruments |
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78 / 122 page ![]() Electrical Specifications 78 April 2001 − Revised September 2004 SPRS163G 5.6.2 Layout Considerations Since parasitic capacitance, inductance and resistance can be significant in any circuit, good PC board layout practices should always be observed when planning trace routing to the discrete components used in the oscillator circuit. Specifically, the crystal and the associated discrete components should be located as close to the DSP as physically possible. Also, X1 and X2/CLKIN traces should be separated as soon as possible after routing away from the DSP to minimize parasitic capacitance between them, and a ground trace should be run between these two signal lines. This also helps to minimize stray capacitance between these two signals. 5.6.3 Clock Generation in Bypass Mode (DPLL Disabled) The frequency of the reference clock provided at the X2/CLKIN pin can be divided by a factor of one, two, or four to generate the internal CPU clock cycle. The divide factor (D) is set in the BYPASS_DIV field of the clock mode register. The contents of this field only affect clock generation while the device is in bypass mode. In this mode, the digital phase-locked loop (DPLL) clock synthesis is disabled. Table 5−3 and Table 5−4 assume testing over recommended operating conditions and H = 0.5tc(CO) (see Figure 5−3). Table 5−3. CLKIN Timing Requirements NO. MIN MAX UNIT C1 tc(CI) Cycle time, X2/CLKIN 20 400† ns C2 tf(CI) Fall time, X2/CLKIN 4 ns C3 tr(CI) Rise time, X2/CLKIN 4 ns C10 tw(CIL) Pulse duration, CLKIN low 6 ns C11 tw(CIH) Pulse duration, CLKIN high 6 ns † This device utilizes a fully static design and therefore can operate with tc(CI) approaching ∞. If an external crystal is used, the X2/CLKIN cycle time is limited by the crystal frequency range listed in Table 5−2. Table 5−4. CLKOUT Switching Characteristics NO. PARAMETER MIN TYP MAX UNIT C4 tc(CO) Cycle time, CLKOUT 20‡ D*tc(CI)§ 1600† ns C5 td(CIH-CO) Delay time, X2/CLKIN high to CLKOUT high/low 10 20 30 ns C6 tf(CO) Fall time, CLKOUT 1 ns C7 tr(CO) Rise time, CLKOUT 1 ns C8 tw(COL) Pulse duration, CLKOUT low H−2 H+2 ns C9 tw(COH) Pulse duration, CLKOUT high H−2 H+2 ns † This device utilizes a fully static design and therefore can operate with tc(CO) approaching ∞. If an external crystal is used, the X2/CLKIN cycle time is limited by the crystal frequency range listed in Table 5−2. ‡ It is recommended that the DPLL synthesised clocking option be used to obtain maximum operating frequency. § D = 1/(PLL Bypass Divider) |
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