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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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TMS320VC5509 датащи(PDF) 71 Page - Texas Instruments |
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TMS320VC5509 датащи(HTML) 71 Page - Texas Instruments |
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71 / 122 page  Documentation Support 71 April 2001 − Revised September 2004 SPRS163G 4.2 TMS320VC5509 Device Nomenclature PREFIX TMS 320 VC 5509 GHH TMX = Experimental device TMP = Prototype device TMS = Qualified device SMJ = MIL-STD-883C SM = High Rel (non-883C) DEVICE FAMILY 320 = TMS320 family TECHNOLOGY PACKAGE TYPE‡ GHH = 179-pin plastic BGA PGE = 144-pin plastic LQFP VC = Dual-Supply CMOS DEVICE 55x DSP: 5509 † No silicon revision marked on the package indicates earlier (TMX or TMP) silicon. See the TMS320VC5509 Digital Signal Processor Silicon Errata (literature number SPRZ006) to identify TMX or TMP silicon revision. ‡ BGA = Ball Grid Array LQFP = Low-Profile Quad Flatpack (31) DEVICE SILICON REVISION† 31 = Revision 3.1 Figure 4−1. Device Nomenclature for the TMS320VC5509 |
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