FXLS8471Q datasheet(69/75 Pages) FREESCALE

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FXLS8471Q

Sensors

Freescale Semiconductor, Inc.

Package Thermal Characteristics

Table 146. Thermal resistance data

Rating

Description

Symbol

Value

Unit

Junction-to-ambient, natural convection(1)(2)

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature,

ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.

2. Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.

Single-layer board

RθJA

163

°C/W

Junction-to-ambient, natural convection(1)(3)

3. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.

Four-layer board (two signals, two planes)

Junction-to-board(4)

4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface

of the board near the package.

RθJB

°C/W

Junction-to-case (top)(5)

5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).

RθJCTop

°C/W

Junction-to-package (top)(6)

6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC

JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.

Natural convection

6°C/W

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