AN2014 datasheet(63/65 Pages) STMICROELECTRONICS

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DocID10701 Rev 10

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AN2014

Revision history

01-Apr-2011

Updated

– Section 4.1.5: Recommended I2C EEPROM connections

– Section 4.2.1: Chip Select (S)

– Section 4.2.2: Write Protect (W)

– Section 4.2.3: Serial Data input (D) and Serial Clock (C)

– Section 4.2.4: Hold (HOLD)

– Section 4.2.6: Recommended SPI EEPROM connections

– Figure 30: Recommended MICROWIRE connections - safe design

– Section 5.5.1: Cycling and data retention qualification procedures

Added Section 5.5.5: Overall number of write cycles

15-Mar-2012

Updated Figure 2: MOSFET-like operation.

Updated Section 1.1.2: Writing a new value to the memory cell.

Renamed Figure 8: VPP signal applied to EEPROM cells (HiV is the

output of the charge pump).

Updated Section 1.1.3: Cycling limit of EEPROM cells.

Updated Section 1.2.1: Memory array architecture.

Updated Table 1: Three serial bus protocols.

Updated Section 2.3: Choosing an appropriate supply voltage and

temperature range.

Updated Section 3.1.2: How to prevent ESD? and Section 3.1.3: ST

EEPROM ESD protection.

Updated Section 3.2.1: What are EOS and latchup? and Section 3.2.2:

How to prevent EOS and latchup events, and Section 3.2.3: ST EEPROM

latchup protection.

Section 4.1: I2C family (M24xxx devices): updated Section 4.1.1: Chip

enable (E0, E1, E2) and Figure 16: Chip Enable inputs E0, E1, E2,

Section 4.1.2: Serial data (SDA), Section 4.1.4: Write control (WC),

Table 6: Connecting WC inputs in I2C products, Section 4.1.5:

Recommended I2C EEPROM connections.

Section 4.2: SPI family (M95xxx devices): updated Section 4.2.1: Chip

Select (S), Section 4.2.3: Serial Data input (D) and Serial Clock (C),

Section 4.2.5: Serial Data output (Q), Figure 26: Recommended SPI

connections - safe design and Figure 27: Recommended SPI connections

- robust design.

Section 4.3: MICROWIRE® family (M93Cxxx and M93Sxxx devices):

updated Section 4.3.1: Chip Select (S), Section 4.3.3: Organization

Select (ORG), Figure 30: Recommended MICROWIRE connections -

safe design, and Figure 31: Recommended MICROWIRE connections -

robust design.

Updated Section 5.1: EEPROM electrical parameters, Section 5.2.1:

Page mode.

Updated Section 5.5.1: Cycling and data retention qualification

procedures, Section 5.5.2: Optimal cycling with ECC, Section 5.5.3:

Cycling and temperature dependence, Section 5.5.4: Defining the

application cycling strategy, and Section 5.5.5: Overall number of write

cycles.

Updated Section 6.1: Application reset.

Table 11. Document revision history (continued)

Date

Revision

Changes

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