LP55281TLSLASHNOPB datasheet(5/35 Pages) TI1

5 / 35 page

LP55281

www.ti.com

SNVS458B – JUNE 2007 – REVISED JUNE 2007

Absolute Maximum Ratings

(1) (2)

V (SW, FB, R1-4, G1-4, B1-4, ALED (3) (4))

-0.3V to +7.2V

VDD1, VDD2, VDDIO, VDDA

-0.3V to +6.0V

Voltage on ASE1-2, IRT, IRGB, VREF

-0.3V to VDD1 +0.3V with 6.0V max

Voltage on Logic Pins

-0.3V to VDDIO + 0.3V with 6.0V max

V (all other pins): Voltage to GND

-0.3V to +6.0V

I (VREF)

10 µA

I (R1-4, G1-4, B1-4)

100 mA

Continuous Power Dissipation (5)

Internally Limited

Junction Temperature (TJ-MAX)

150°C

Storage Temperature Range

-65°C to +150°C

Maximum Lead Temperature (Reflow

260°C

soldering, 3 times) (6)

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed

performance limits and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pins.

(3)

Battery/Charger voltage should be above 6V no more than 10% of the operational lifetime.

(4)

Voltage tolerance of LP55281 above 6.0V relies on fact that VDD1 and VDD2 (2.8V) are available (ON) at all conditions. If VDD1 and VDD2

are not available (ON) at all conditions, National Semiconductor® does not guarantee any parameters or reliability for this device.

(5)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 160°C (typ.) and

disengages at TJ = 140°C (typ.)

(6)

For detailed soldering specifications and information, please refer to National Semiconductor Application Note AN1112 : Micro SMD

Wafer Level Chip Scale Package or National Semiconductor Application Note AN1412 : Micro SMDxt Wafer Level Chip Scale Package.

ESD Rating

Human Body Model (1)

2 kV

(1)

The Human Body Model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin. MIL-STD-883 3015.7

Operating Ratings

(2) (3)

V (SW, FB, R1-4, G1-4, B1-4, ALED)

0 to 6.0V

VDD1,2 with external LDO

2.7V to 5.5V

VDD1,2 with internal LDO

3.0V to 5.5V

VDDA

2.7V to 2.9V

VDDIO

1.65V to VDD1

Voltage on ASE1-2

0.1V to VDDA - 0.1V

Recommended Load Current

0 mA to 300 mA

Junction Temperature (TJ) Range

-30°C to +125°C

Ambient Temperature (TA) Range

(1)

-30°C to +85°C

(2)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed

performance limits and associated test conditions, see the Electrical Characteristics tables.

(3)

All voltages are with respect to the potential at the GND pins.

(1)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP - (θJA x PD-MAX).

Thermal Properties

Junction-to-Ambient Thermal Resistance (

θJA), TLA36AAA Package

60°C/W

(1)

Junction-to-Ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design.

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