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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STM8L151F3P6 датащи(PDF) 111 Page - STMicroelectronics |
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STM8L151F3P6 датащи(HTML) 111 Page - STMicroelectronics |
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111 / 112 page  STM8L151x2, STM8L151x3 Revision history Doc ID 018780 Rev 4 111/112 12 Revision history Table 63. Document revision history Date Revision Changes 08-Jun-2011 1 Initial release 02-Sep-2011 2 Modified Figure 8: Memory map on page 33. Modified OPT1 description in Table 12: Option byte addresses on page 52 Modified tprog in Table 36: Flash program and data EEPROM memory on page 79 Modified Figure 32: Recommended NRST pin configuration on page 88 Modified L2 in Figure 47: UFQFPN20 - 20-lead ultra thin fine pitch quad flat package outline (3x3) on page 110 PM0051 replaced with PM0054 and UM0320 replaced with UM0470. 09-Feb-2012 3 Added part number STM8L151C2. Figure 3 and Figure 4: updated titles. Table 4: Low density STM8L15xxx pin description: updated OD column of NRST/PA1 pin. Figure 43: UFQFPN32 - 32-lead ultra thin fine pitch quad flat no- lead package outline (5 x 5): removed the line over A1. Figure 45: UFQFPN28 package outline: replaced to improve readability of UFQFPN28 package dimensions A, L, and L1. Figure 46: Recommended UFQFPN28 footprint (dimensions in mm): updated title. Figure 48: UFQFPN20 recommended footprint (dimensions in mm): added. Table 62: TSSOP20 - 20-pin thin shrink small outline package mechanical data: updated title. 06-Jul-2012 4 Added “I/O level” in Table 3: Legend/abbreviation for table 4 and Table 4: Low density STM8L15xxx pin description on page 27 Updated Figure 47: UFQFPN20 - 20-lead ultra thin fine pitch quad flat package outline (3x3) on page 107 Updated Figure 35: SPI1 timing diagram - master mode(1) on page 82 Updated Table 11: Voltage characteristics on page 50, Table 34: I/O static characteristics on page 73 |
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