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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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PCF2123TS датащи(PDF) 57 Page - NXP Semiconductors |
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PCF2123TS датащи(HTML) 57 Page - NXP Semiconductors |
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57 / 63 page  PCF2123 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 27 April 2011 57 of 63 NXP Semiconductors PCF2123 SPI Real time clock/calendar 20. Footprint information for reflow soldering Fig 40. Footprint information for reflow soldering of SOT758-1 (HVQFN16) package of PCF2123BS/1 SOT758-1 Footprint information for reflow soldering of HVQFN16 package Dimensions in mm Ax Ay Bx By D SLx SLy SPx tot SPy tot SPx SPy Gx Gy Hx Hy 4.000 4.000 2.200 2.200 P 0.500 0.240 C 0.900 1.500 1.500 0.650 0.650 0.650 0.650 3.300 3.300 4.250 4.250 nSPx nSPy 11 sot758-1_fr occupied area Ax Bx SLx Gx Gy Hy Hx Ay By SLy P 0.025 0.025 D (0.105) SPx tot nSPx nSPy SPx SPy solder land plus solder paste solder land solder paste deposit C Generic footprint pattern Refer to the package outline drawing for actual layout Issue date 07-05-07 09-06-15 |
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