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PCF2123TS датащи(PDF) 39 Page - NXP Semiconductors

номер детали PCF2123TS
подробное описание детали  SPI Real time clock/calendar Time keeping application
PDF  63 Pages
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производитель  NXP [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo NXP - NXP Semiconductors

PCF2123TS датащи(HTML) 39 Page - NXP Semiconductors

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PCF2123
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 27 April 2011
39 of 63
NXP Semiconductors
PCF2123
SPI Real time clock/calendar
11. Limiting values
[1]
With respect to VSS.
[2]
Pass level; Human Body Model (HBM) according to Ref. 8 “JESD22-A114”
[3]
Pass level; latch-up testing, according to Ref. 9 “JESD78” at maximum ambient temperature (Tamb(max)).
[4]
According to the NXP store and transport requirements (see Ref. 11 “NX3-00092”) the devices have to be
stored at a temperature of +8
°C to +45 °C and a humidity of 25 % to 75 %. For long term storage products
deviant conditions are described in that document.
Table 43.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDD
supply voltage
[1]
−0.5
+6.5
V
IDD
supply current
−50
+50
mA
VI
input voltage
[1]
−0.5
+6.5
V
VO
output voltage
[1]
−0.5
+6.5
V
II
input current
−10
+10
mA
IO
output current
−10
+10
mA
Ptot
total power dissipation
-
300
mW
VESD
electrostatic discharge
voltage
HBM
[2] -
±3000 V
Ilu
latch-up current
[3] -200
mA
Tstg
storage temperature
[4]
−65
+150
°C
Tamb
ambient temperature
operating device
−40
+85
°C



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