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PCF2123TS датащи(PDF) 52 Page - NXP Semiconductors

номер детали PCF2123TS
подробное описание детали  SPI Real time clock/calendar Time keeping application
PDF  63 Pages
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производитель  NXP [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo NXP - NXP Semiconductors

PCF2123TS датащи(HTML) 52 Page - NXP Semiconductors

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PCF2123
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 27 April 2011
52 of 63
NXP Semiconductors
PCF2123
SPI Real time clock/calendar
17. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that
all normal precautions are taken as described in JESD625-A, IEC 61340-5 or equivalent
standards.
18. Packing information
[1]
Wafer mapping information will be distributed to customer’s ftp server.
(1) Die marking code.
Seal ring plus gap to active circuit ~18
μm.
Fig 36. PCF2123Ux wafer information
013aaa232
Saw lane
~18
μm
45
μm
70
μm
~18
μm
detail X
1.449 mm
1.492 mm
1
1
1
1
X
straight edge
of the wafer
(1)
Table 50.
PCF2123Ux wafer information
Type number
Wafer thickness (
μm) Wafer diameter
Marking of bad die
PCF2123U/5GA/1
687
6 inch
wafer mapping[1]
PCF2123U/10AA/1
200
6 inch
inking
PCF2123U/12AA/1
200
6 inch
wafer mapping[1]
PCF2123U/12HA/1
150
6 inch
inking



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