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PCF2123TS датащи(PDF) 46 Page - NXP Semiconductors |
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PCF2123TS датащи(HTML) 46 Page - NXP Semiconductors |
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46 / 63 page ![]() PCF2123 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 27 April 2011 46 of 63 NXP Semiconductors PCF2123 SPI Real time clock/calendar Fig 31. Package outline SOT402-1 (TSSOP14) of PCF2123TS/1 UNIT A1 A2 A3 bp cD (1) E (2) (1) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.72 0.38 8 0 o o 0.13 0.1 0.2 1 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 SOT402-1 MO-153 99-12-27 03-02-18 w M b p D Z e 0.25 17 14 8 θ A A1 A2 L p Q detail X L (A ) 3 HE E c v M A X A y 0 2.5 5 mm scale TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 A max. 1.1 pin 1 index |
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