 |
поискавой системы для электроныых деталей |
|
|
поискавой системы для электроныых деталей |
|
PCF2123TS датащи(PDF) 48 Page - NXP Semiconductors |
|
|
|||||||||||||||||||||||||||||
PCF2123TS датащи(HTML) 48 Page - NXP Semiconductors |
|
|
48 / 63 page  PCF2123 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 27 April 2011 48 of 63 NXP Semiconductors PCF2123 SPI Real time clock/calendar 16. Bare die outline [1] Nominal die thickness. Compare with wafer thickness given in Table 50. [2] Dimension includes saw lane. [3] P1 and P3: pad size. [4] P2 and P4: passivation opening. Fig 33. Bare die outline PCF2123U/10 of PCF2123U/5GA/1 and PCF2123U/10AA/1 (for dimensions see Table 46) REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA PCF2123U/10 Wire bond die; 12 bonding pads PCF2123U/10 08-07-24 11-04-06 0 scale 1 mm A P4 P3 P2 P1 detail X D E eD x y 0 0 12 11 10 9 8 7 6 5 4 3 2 1 X Table 46. Dimensions of PCF2123U/10 Original dimensions are in mm. Unit (mm) A[1] D[2] E[2] eD P1[3] P2[4] P3[3] P4[4] PCF2123U/5GA/1 nom 0.20 1.492 1.449 1.296 0.09 0.081 0.09 0.081 PCF2123U/10AA/1 nom 0.20 1.492 1.449 1.296 0.09 0.081 0.09 0.081 |
|
ссылки URL |
| Вашему бизинису помогли Аллдатащит? [ DONATE ] |
Что такое Аллдатащит | реклама | контакт | Конфиденциальность | Ссылка на техническое описание | обмен ссыками | поиск по производителю All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
Russian ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
