OMAP3530-HiRel datasheet(7/239 Pages) TI

7 / 239 page

Contents

OMAP3525-HiRel and OMAP3530-HiRel Applications Processors

www.ti.com

SPRS599 – JUNE 2009

OMAP3525-HiRel and OMAP3530-HiRel

4.2

Output Clock Specifications

........................ 113

Applications Processors

............................... 1

4.3

DPLL and DLL Specifications

...................... 115

1.1

Features

.............................................. 1

VIDEO DAC SPECIFICATIONS

..................... 122

1.2

SUPPORTS DEFENSE, AEROSPACE, AND

5.1

Interface Description

............................... 122

MEDICAL APPLICATIONS

........................... 3

5.2

Electrical Specifications Over Recommended

1.3

Description

............................................ 4

Operating Conditions

.............................. 124

1.4

Functional Block Diagram

............................ 6

5.3

Analog Supply (vdda_dac) Noise Requirements

.. 126

TERMINAL DESCRIPTION

.............................. 8

5.4

External Component Value Choice

................ 127

2.1

Terminal Assignment

................................. 8

TIMING REQUIREMENTS AND SWITCHING

2.2

Ball Characteristics

.................................. 12

CHARACTERISTICS

.................................. 128

2.3

Multiplexing Characteristics

......................... 50

6.1

Timing Test Conditions

............................ 128

2.4

Signal Description

................................... 66

6.2

Interface Clock Specifications

..................... 128

ELECTRICAL CHARACTERISTICS

.................. 93

6.3

Timing Parameters

................................. 129

3.1

Power Domains

..................................... 93

6.4

External Memory Interfaces

........................ 130

3.2

Absolute Maximum Ratings

......................... 95

6.5

Video Interfaces

.................................... 159

3.3

Recommended Operating Conditions

............... 97

6.6

Serial Communications Interfaces

................. 179

3.4

DC Electrical Characteristics

........................ 99

6.7

Removable Media Interfaces

...................... 212

3.5

Core Voltage Decoupling

.......................... 102

6.8

Test Interfaces

..................................... 227

3.6

Power-up and Power-down

........................ 104

PACKAGE CHARACTERISTICS

.................... 233

CLOCK SPECIFICATIONS

........................... 107

7.1

Package Thermal Resistance

...................... 233

4.1

Input Clock Specifications

......................... 108

7.2

Device Support

..................................... 233

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