M38039G8HKP datasheet(90/92 Pages) RENESAS

90 / 92 page

Rev.1.10

Nov 14, 2005

Page 90 of 91

REJ03B0166-0110

3803 Group (Spec.H QzROM version)

PRELIMINARY

Notice: This is not a final specification.

Some parametric limits are subject to change.

Notes on Restarting Oscillation

• Restarting oscillation

Usually, when the MCU stops the clock oscillation by STP

instruction and the STP instruction has been released by an

external interrupt source, the fixed values of Timer 1 and

Prescaler 12 (Timer 1 = “0116”, Prescaler 12 = “FF16”) are

automatically reloaded in order for the oscillation to stabilize.

The user can inhibit the automatic setting by writing “1” to bit 0

of MISRG (address 001016).

However, by setting this bit to “1”, the previous values, set just

before the STP instruction was executed, will remain in Timer 1

and Prescaler 12. Therefore, you will need to set an appropriate

value to each register, in accordance with the oscillation

stabilizing time, before executing the STP instruction.

Oscillation will restart when an external interrupt is received.

However, internal clock

φ is supplied to the CPU only when

Timer 1 starts to underflow. This ensures time for the clock

oscillation using the ceramic resonators to be stabilized.

Notes on Using Stop Mode

• Register setting

Since values of the prescaler 12 and Timer 1 are automatically

reloaded when returning from the stop mode, set them again,

respectively. (When the oscillation stabilizing time set after STP

instruction released bit is “0”)

• Clock restoration

After restoration from the stop mode to the normal mode by an

interrupt request, the contents of the CPU mode register previous

to the STP instruction execution are retained. Accordingly, if

both main clock and sub clock were oscillating before execution

of the STP instruction, the oscillation of both clocks is resumed

at restoration.

In the above case, when the main clock side is set as a system

clock, the oscillation stabilizing time for approximately 8,000

cycles of the XIN input is reserved at restoration from the stop

mode. At this time, note that the oscillation on the sub clock side

may not be stabilized even after the lapse of the oscillation

stabilizing time of the main clock side.

Notes on Wait Mode

• Clock restoration

If the wait mode is released by a reset when XCIN is set as the

system clock and XIN oscillation is stopped during execution of

the WIT instruction, XCIN oscillation stops, XIN oscillations

starts, and XIN is set as the system clock.

In the above case, the RESET pin should be held at “L” until the

oscillation is stabilized.

Notes on Handling of Power Source Pins

In order to avoid a latch-up occurrence, connect a capacitor

suitable for high frequencies as bypass capacitor between power

source pin (VCC pin) and GND pin (VSS pin), and between power

source pin (VCC pin) and analog power source input pin (AVSS

pin). Besides, connect the capacitor to as close as possible. For

bypass capacitor which should not be located too far from the

pins to be connected, a ceramic capacitor of 0.01

µF–0.1 µF is

recommended.

Power Source Voltage

When the power source voltage value of a microcomputer is less

than the value which is indicated as the recommended operating

conditions, the microcomputer does not operate normally and

may perform unstable operation.

In a system where the power source voltage drops slowly when

the power source voltage drops or the power supply is turned off,

reset a microcomputer when the power source voltage is less

than the recommended operating conditions and design a system

not to cause errors to the system by this unstable operation.

Electric Characteristic Differences Between Flash

Memory, Mask ROM and QzROM Version MCUs

There are differences in the manufacturing processes and the

mask pattern among flash memory, mask ROM, and QzROM

version MCUs due to the differences of the ROM type. Even

when the ROM type is the same, when the memory size is

different, the manufacturing processes and the mask pattern

differ. For these reasons, the oscillation circuit constants and the

characteristics such as a characteristic value, operation margin,

noise immunity, and noise radiation within the limits of electrical

characteristics may differ.

When manufacturing an application system, please perform

sufficient evaluations in each product. Especially, when

switching a product (example: change from the mask ROM

version to QzROM version), please perform sufficient

evaluations by the switching product in the stage before mass-

producing an application system.

Product Shipped in Blank

As for the product shipped in blank, Renesas does not perform

the writing test to user ROM area after the assembly process

though the QzROM writing test is performed enough before the

assembly process. Therefore, a writing error of approx.0.1 %

may occur. Moreover, please note the contact of cables and

foreign bodies on a socket, etc. because a writing environment

may cause some writing errors.

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