9 Application and Implementation

Note

Information in the following applications sections is not part of the TI component specification,

and TI does not warrant its accuracy or completeness. TI’s customers are responsible for

determining suitability of components for their purposes, as well as validating and testing their design

implementation to confirm system functionality.

9.1 Application Information

The TMP461-EP device requires only a transistor connected between the D+ and D– pins for remote

temperature measurement. Tie the D+ pin to D– or GND if the remote channel is not used and only the

local temperature is measured. The SDA, ALERT, and THERM pins (and SCL, if driven by an open-drain

output) require pullup resistors as part of the communication bus. A 0.1µF power-supply decoupling capacitor is

recommended for local bypassing. Figure 9-1 and Figure 9-2 show the typical configurations for the TMP461-EP

device.

9.2 Typical Application

GND

SDA

SCL

A1

D–

D+

ALERT/ THERM2

A0

V+

THERM

TMP461-EP

6

7

8

9

10

1

2

3

4

5

SMBus

Controller

GND

GND

Overtemperature

Shutdown

1.7V to 3.6V

1.7V to 3.6V

GND

Built-in

Thermal

Transistor

or Diode

FPGA, ADC,

DAC, or ASIC

CDIFF

RS

RS

PNP Diode-connected configuration

(A):

CDIFF

RS

NPN Diode-connected configuration

(A):

Transistor-connected configuration

(A):

RS

CDIFF

RS

RS

(B)

(B)

(B)

(B)

(B)

(B)

(C)

(C)

(C)

Figure 9-1. TMP461-EP Basic Connections Using a Discrete Remote Transistor

A.

A diode-connected configuration provides better settling time. The transistor-connected configuration provides better series resistance

cancellation. NPN transistors must be diode-connected. PNP transistors can either be transistor-connected or diode-connected. For

more information on NPN/PNP transistors, see the Remote Temperature Sensor Transistor Selection Guide application note.

B.

Rs (optional) must be < 1kΩ in most applications. Selections of Rs depend on specific applications; see the Section 7.3.4

C.

CDIFF (optional) must be < 1000pF in most applications. Selections of CDIFF depend on the specific application; see the Section 7.3.4

and Figure 6-6.

TMP461-EP

SNIS241 – SEPTEMBER 2025

www.ti.com

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