ADA4356ABCZ datasheet(19/61 Pages) AD

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Data Sheet

ADA4356

analog.com

Rev. 0

19 of 61

Thermal Resistance

Thermal performance is directly linked to PCB design and operating environment. Close attention to PCB thermal

design is required.

Thermal resistance values specified in Table 7 are calculated based on standard JEDEC specifications.

Table 7. Thermal Resistance

PACKAGE TYPE

ӨJA

ӨJC_TOP

ψJT

UNIT

BC-84-4

52.6

22.0

17.7

°C/W

Only use θJA and θJC_TOP to compare thermal performance of the package of the device with other semiconductor

packages when all test conditions listed are similar. One common mistake is to use θJA and θJC to estimate the

junction temperature in the system environment. Instead, using ΨJT is a more appropriate way to estimate the

worst-case junction temperature of the device in the system environment. First, take an accurate thermal

measurement of the top center of the device (on the mold compound in this case) while the device operates in the

system environment. This measurement is known in the following equation as TTOP. Then, use this equation to solve

for the worst-case TJ in that given environment as follows:

TJ = ΨJT × P + TTOP

where:

ΨJT is the junction-to-top thermal characterization number as specified in the data sheet.

P refers to the total power dissipation in the chip (W).

TTOP refers to the package top temperature (°C) and is measured at the top center of the package in that given

environment.

ESD Caution

ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can

discharge without detection. Although this product features patented or proprietary

protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore,

proper ESD precautions should be taken to avoid performance degradation or loss of

functionality.

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