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DAC80504 датащи(PDF) 5 Page - Texas Instruments

номер детали DAC80504
подробное описание детали  DACx0504 Quad, 16-, 14-, 12-bit, SPI voltage output DACs with internal reference
PDF  50 Pages
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производитель  TI2 [Texas Instruments]
домашняя страница  https://www.ti.com
Logo TI2 - Texas Instruments

DAC80504 датащи(HTML) 5 Page - Texas Instruments

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1
REF
12
CS
2
OUT0
11
LDAC
3
OUT1
10
REFDIV
4
OUT2
9
RSTSEL
Not to scale
Thermal Pad
5
DAC80504, DAC70504, DAC60504
www.ti.com
SBAS871C – AUGUST 2017 – REVISED JANUARY 2019
Product Folder Links: DAC80504 DAC70504 DAC60504
Submit Documentation Feedback
Copyright © 2017–2019, Texas Instruments Incorporated
6 Pin Configuration and Functions
RTE Package
16-Pin WQFN
Top View
Pin Functions
PIN
TYPE
DESCRIPTION
NAME
NO.
REF
1
I/O
When using internal reference, this is the reference output voltage pin (default). When using an
external reference, this is the reference input pin to the device.
OUT0
2
O
Analog output voltage from DAC 0.
OUT1
3
O
Analog output voltage from DAC 1.
OUT2
4
O
Analog output voltage from DAC 2.
OUT3
5
O
Analog output voltage from DAC 3.
GND
6
GND
Ground reference point for all circuitry on the device.
VDD
7
PWR
Analog supply voltage (2.7 V to 5.5 V).
GAIN
8
I
Sets the gain configuration after a power-up or reset event. When tied to GND, the initial buffer
amplifier gain for all four channels is set to 1. When tied to VIO the initial buffer amplifier gain is 2.
Changing the state of this pin after power-up does not affect the device operation.
RSTSEL
9
I
Reset select pin. When tied to GND all four DACs reset to zero scale. When connected to VIO all four
DACs reset to midscale.
REFDIV
10
I
Sets the reference divider configuration after a power-up or reset event. When tied to GND, the
reference voltage is not divided down. When tied to VIO the reference voltage is divided by 2. Changing
the state of this pin after power-up does not affect the device operation.
LDAC
11
I
A high-to-low transition on the LDAC pin causes the DAC outputs of those channels configured in
synchronous mode to update simultaneously. The pin can be tied permanently to GND.
CS
12
I
Active low serial data enable. This input is the frame synchronization signal for the serial data. When
the signal goes low, it enables the serial interface input shift register.
SCLK
13
I
Serial interface clock.
SDI
14
I
Serial interface data input. Data are clocked into the input shift register on each falling edge of the
SCLK pin.
SDO/ALARM
15
O
Serial interface data output (default). The SDO pin is in high impedance when CS pin is high. Data are
clocked out of the input shift register on either rising or falling edges of the SCLK pin as specified by
the FSDO bit. Alternatively the pin can be configured as an ALARM open-drain output to indicate a
CRC or reference alarm event. If configured as ALARM a 10 kΩ, pull-up resistor to VIO is required.
VIO
16
PWR
IO supply voltage (1.7 V to 5.5 V). This pin sets the I/O operating voltage for the serial interface.
Thermal Pad
–
–
The thermal pad is located on the bottom-side of the QFN package. The thermal pad should be
connected to any internal PCB ground plane using multiple vias for good thermal performance.



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