PCF8545ATTSLASHA datasheet(70/72 Pages) NXP

70 / 72 page

PCF8545

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Product data sheet

Rev. 1 — 13 November 2013

70 of 72

NXP Semiconductors

PCF8545

Universal LCD driver for multiplex rates up to 1:8

27. Figures

Fig 1.

Block diagram of PCF8545A . . . . . . . . . . . . . . . . .3

Fig 2.

Block diagram of PCF8545B . . . . . . . . . . . . . . . . .4

Fig 3.

Pin configuration for TSSOP56 (PCF8545ATT). . .5

Fig 4.

Pin configuration for TSSOP56 (PCF8545BTT) . .5

Fig 5.

Effect of backplane swapping . . . . . . . . . . . . . . . .9

Fig 6.

Recommended power-down sequence . . . . . . . .10

Fig 7.

Oscillator selection. . . . . . . . . . . . . . . . . . . . . . . .12

Fig 8.

Recommended start-up sequence when

using the internal oscillator . . . . . . . . . . . . . . . . .18

Fig 9.

Recommended start-up sequence when

using an external clock signal . . . . . . . . . . . . . . .19

Fig 10. Example of displays suitable for PCF8545 . . . . .20

Fig 11. Typical system configuration for the I2C-bus . . . .21

Fig 12. Typical system configuration for the SPI-bus. . . .21

Fig 13. Electro-optical characteristic: relative

transmission curve of the liquid . . . . . . . . . . . . . .23

Fig 14. Waveforms for the 1:4 multiplex drive mode

with 1⁄3 bias and line inversion . . . . . . . . . . . . . . .24

Fig 15. Waveforms for 1:6 multiplex drive mode with

bias 1⁄3 and line inversion. . . . . . . . . . . . . . . . . . .25

Fig 16. Waveforms for 1:6 multiplex drive mode with

bias 1⁄4 and line inversion. . . . . . . . . . . . . . . . . . .26

Fig 17. Waveforms for 1:8 multiplex drive mode with

bias 1⁄4 and line inversion. . . . . . . . . . . . . . . . . . .27

Fig 18. Waveforms for 1:8 multiplex drive mode with

bias 1⁄4 and frame inversion . . . . . . . . . . . . . . . . .28

Fig 19. Display RAM bitmap . . . . . . . . . . . . . . . . . . . . . .30

Fig 20. Display RAM filling order in 1:4 multiplex

drive mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32

Fig 21. Boundary condition in 1:4 multiplex drive mode .32

Fig 22. Display RAM filling order in 1:6 multiplex

drive mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33

Fig 23. Boundary condition in 1:6 multiplex drive mode .34

Fig 24. Display RAM filling order in 1:8 multiplex

drive mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35

Fig 25. Control byte format . . . . . . . . . . . . . . . . . . . . . . .36

Fig 26. Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37

Fig 27. Definition of START and STOP conditions. . . . . .37

Fig 28. System configuration . . . . . . . . . . . . . . . . . . . . . .38

Fig 29. Acknowledgement on the I2C-bus . . . . . . . . . . . .38

Fig 30. I2C-bus protocol write mode . . . . . . . . . . . . . . . .40

Fig 31. I2C-bus protocol read mode. . . . . . . . . . . . . . . . .40

Fig 32. Data transfer overview . . . . . . . . . . . . . . . . . . . . .42

Fig 33. SPI-bus write example . . . . . . . . . . . . . . . . . . . . .43

Fig 34. SPI-bus example . . . . . . . . . . . . . . . . . . . . . . . . .43

Fig 35. Device protection diagram for PCF8545A . . . . . .44

Fig 36. Device protection diagram for PCF8545B . . . . . .44

Fig 37. Typical IDD with respect to temperature . . . . . . . .48

Fig 38. Typical IDD(LCD) in power-down mode with

respect to temperature. . . . . . . . . . . . . . . . . . . . .48

Fig 39. Typical IDD(LCD) when display is active with

respect to temperature. . . . . . . . . . . . . . . . . . . . .49

Fig 40. Typical clock frequency with respect to VDD

and temperature . . . . . . . . . . . . . . . . . . . . . . . . .50

Fig 41. Driver timing waveforms . . . . . . . . . . . . . . . . . . .50

Fig 42. RESET timing . . . . . . . . . . . . . . . . . . . . . . . . . . .51

Fig 43. I2C-bus timing waveforms . . . . . . . . . . . . . . . . . . 52

Fig 44. SPI-bus timing. . . . . . . . . . . . . . . . . . . . . . . . . . . 53

Fig 45. Package outline SOT364-1 (TSSOP56) . . . . . . . 54

Fig 46. Tape and reel details for PCF8545ATT and

PCF8545BTT . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

Fig 47. Temperature profiles for large and small

components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

Fig 48. Footprint information for reflow soldering of

SOT364-1 (TSSOP56) package . . . . . . . . . . . . . 60

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