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TEST датащи(PDF) 49 Page - List of Unclassifed Manufacturers

номер детали TEST
подробное описание детали  Low-voltage translating, 8-bit I2C-bus/SMBus I/O expander with interrupt output, reset, and configuration registers
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NXP Semiconductors
PCAL6408A
Low-voltage translating, 8-bit I2C-bus/SMBus I/O expander
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 18 September 2013
Document identifier: PCAL6408A
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
23. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 2
2.1
Agile I/O features . . . . . . . . . . . . . . . . . . . . . . . 3
3
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
3.1
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 4
4
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
5
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
5.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
5.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
6
Voltage translation . . . . . . . . . . . . . . . . . . . . . . . 7
7
Functional description . . . . . . . . . . . . . . . . . . . 7
7.1
Device address . . . . . . . . . . . . . . . . . . . . . . . . . 7
7.2
Interface definition . . . . . . . . . . . . . . . . . . . . . . 8
7.3
Pointer register and command byte . . . . . . . . . 8
7.4
Register descriptions . . . . . . . . . . . . . . . . . . . . 9
7.4.1
Input port register (00h) . . . . . . . . . . . . . . . . . . 9
7.4.2
Output port register (01h) . . . . . . . . . . . . . . . . . 9
7.4.3
Polarity inversion register (02h) . . . . . . . . . . . . 9
7.4.4
Configuration register (03h) . . . . . . . . . . . . . . . 9
7.4.5
Output drive strength registers (40h, 41h) . . . 10
7.4.6
Input latch register (42h). . . . . . . . . . . . . . . . . 10
7.4.7
Pull-up/pull-down enable register (43h) . . . . . 11
7.4.8
Pull-up/pull-down selection register (44h). . . . 11
7.4.9
Interrupt mask register (45h) . . . . . . . . . . . . . 11
7.4.10
Interrupt status register (46h) . . . . . . . . . . . . . 12
7.4.11
Output port configuration register (4Fh) . . . . . 12
7.5
I/O port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
7.6
Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . 14
7.7
Reset input (RESET) . . . . . . . . . . . . . . . . . . . 14
7.8
Interrupt output (INT) . . . . . . . . . . . . . . . . . . . 14
8
Bus transactions . . . . . . . . . . . . . . . . . . . . . . . 15
8.1
Write commands. . . . . . . . . . . . . . . . . . . . . . . 15
8.2
Read commands . . . . . . . . . . . . . . . . . . . . . . 16
9
Application design-in information . . . . . . . . . 18
9.1
Minimizing IDD when I/Os control LEDs . . . . . 18
9.2
Output drive strength control . . . . . . . . . . . . . 19
9.3
Power-on reset requirements . . . . . . . . . . . . . 20
9.4
Device current consumption with internal
pull-up and pull-down resistors . . . . . . . . . . . . 22
10
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 23
11
Recommended operating conditions. . . . . . . 23
12
Thermal characteristics . . . . . . . . . . . . . . . . . 24
13
Static characteristics . . . . . . . . . . . . . . . . . . . . 24
13.1
Typical characteristics . . . . . . . . . . . . . . . . . . 27
14
Dynamic characteristics . . . . . . . . . . . . . . . . . 31
15
Parameter measurement information . . . . . . 32
16
Package outline. . . . . . . . . . . . . . . . . . . . . . . . 36
17
Soldering of SMD packages . . . . . . . . . . . . . . 40
17.1
Introduction to soldering. . . . . . . . . . . . . . . . . 40
17.2
Wave and reflow soldering. . . . . . . . . . . . . . . 40
17.3
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . 40
17.4
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . 41
18
Soldering: PCB footprints . . . . . . . . . . . . . . . 43
19
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 46
20
Revision history . . . . . . . . . . . . . . . . . . . . . . . 46
21
Legal information . . . . . . . . . . . . . . . . . . . . . . 47
21.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 47
21.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
21.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 47
21.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 48
22
Contact information . . . . . . . . . . . . . . . . . . . . 48
23
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49



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