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STAC9752 датащи(PDF) 90 Page - Integrated Device Technology

номер детали STAC9752
подробное описание детали  TWO-CHANNEL, 20-BIT, AC??7 2.3 CODECS WITH HEADPHONE DRIVE, SPDIF OUTPUT MICROPHONE & JACK SENSING
PDF  95 Pages
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производитель  IDT [Integrated Device Technology]
домашняя страница  http://www.idt.com
Logo IDT - Integrated Device Technology

STAC9752 датащи(HTML) 90 Page - Integrated Device Technology

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STAC9752/9753
TWO-CHANNEL, 20-BIT, AC’97 2.3 CODECS WITH HEADPHONE DRIVE, SPDIF OUTPUT MICROPHONE & JACK SENSING
IDT™
90
STAC9752/9753
REV 3.3 1206
TWO-CHANNEL, 20-BIT, AC’97 2.3 CODECS WITH HEADPHONE DRIVE, SPDIF OUTPUT MICROPHONE & JACK SENSING
15. SOLDER REFLOW PROFILE
15.1. Standard Reflow Profile Data
Note: These devices can be hand soldered at 360 oC for 3 to 5 seconds.
FROM: IPC / JEDEC J-STD-020C “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid
State Surface Mount Devices” (www.jedec.org/download).
Figure 25. Reflow Profile
Profile Feature
Pb Free Assembly
Average Ramp-Up Rate (Tsmax - Tp)
3 oC / second max
Preheat
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (tsmin - tsmax)
150 oC
200
o C
60 - 180 seconds
Time maintained above
Temperature (TL)
Time (tL)
217
o C
60 - 150 seconds
Peak / Classification Temperature (Tp)
See “Package Classification Reflow Temperatures” on page 91.
Time within 5 oC of actual Peak Temperature (tp)
20 - 40 seconds
Ramp-Down rate
6 oC / second max
Time 25 oC to Peak Temperature
8 minutes max
Note: All temperatures refer to topside of the package, measured on the package body surface.



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